Datasheet > 84535-201LF

84535-201LF

更新时间： 2024-10-02 14:47:15

品牌	Logo	应用领域
安费诺 - AMPHENOL		连接器
页数	文件大小	规格书
4页	186K
描述
Board Stacking Connector, 200 Contact(s), 10 Row(s), Female, Straight, Surface Mount Terminal, Receptacle, ROHS COMPLIANT

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84535-201LF 数据手册

BOARD TO BOARD CONNECTORS

MEG-ARRAY CONNECTOR SYSTEM

DESCRIPTION

The MEG-Array^®connector is designed to meet the needs

of 10Gb/s applications requiring up to 528 signal pins per

connector. The combination of multiple stack heights (4mm

to 14mm) and multiple sizes (81 signals to 528 signals)

allows for optimal design flexibility while yielding less than

1% cross-talk performance when configured differentially.

FCI has produced the MEG-Array^®Connector System since

1996, shipping over 10 billion BGA contact interfaces

illustrating FCI’s extended tradition as the premier BGA

interconnect innovator and supplier. FCI’s patented BGA

design is supported by fully automated quality control

systems featuring 100% inspections of assembly coplanarity,

solder sphere size and location, as well as critical-to-function

terminal component attributes. Multiple in-line vision systems,

quality control product audits, and statistical process controls

are all a part of our state-of-the-art manufacturing facility.

FEATURES & BENEFITS

TARGET MARKETS / APPLICATIONS

RoHS Compliant (Lead-Free)

Communications

• Transmission

• Access

Ball Grid Array (BGA) termination for process friendly attachment

.050" x .050" BGA interface pitch optimizes routing and electrical

performance

• Switching

Stack Heights available from 4mm to 14mm (2mm increments)

Connector sizes of 81 signals to 528 signals providing 80 usable

signals per linear cm (205 signals per linear inch) allow for

optimization of board space and signal requirements

10 Gb/s differential pair performance at less than 1% cross-talk

meets the needs of high speed mezzanine applications

Meets Telcordia GR-1217-CORE and NPS-25298-2 specifications

for utilization in telecom applications

Demonstrated solder joint reliability of greater than 22 years life

(per IPC-SM-785) is unmatched for a BGA mezzanine connector

Polarized design assures proper mating of the connector

Back to Back testing connector (Interposer) available upon

special request

• Optics

• Networking

Data

• Servers

• Storage

I & I

• Industrial controls & equipment

• Analytical & diagnostic

• Medical

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