Datasheet > 82563EB

82563EB

更新时间： 2022-05-24 13:42:48

品牌	Logo	应用领域
英特尔 - INTEL		局域网
页数	文件大小	规格书
52页	572K
描述
82563EB/82564EB Gigabit Platform LAN Connect

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82563EB 数据手册

82563EB/82564EB Gigabit Platform LAN

Connect

Networking Silicon

Datasheet

Product Features

■ IEEE 802.3ab compliant

—Allows PHY placement proximity to I/O

back panel.

—Robust operation over the installed base of

Category-5 (Cat-5) twisted pair cabling

■ PICMG 3.1 compliant

■ 7 LED outputs per port (4 configurable plus 3

dedicated)

—Link and Activity indications (10, 100,

1000 Mb/s) on each port

—Robust operation in backplane over

Ethernet applications.

■ Clock supplied to the 631xESB/632xESB

—Cost optimized design

■ Support for cable line lengths greater than

100 m (spec); 123 m physical

—Robust end to end connections over

various cable lengths

■ Full chip power down

—Support for lowest power state

■ 100 pin TQFP Package

■ Full duplex at 10, 100, or 1000 Mb/s and half

duplex at 10 or 100 Mb/s.

—Smaller footprint and lower power

dissipation compared to multi-chip MAC

and PHY solutions

■ IEEE 802.3ab Auto-negotiation with Next

Page support

—Automatic link configuration including

speed, duplex, and flow control

■ 10/100 downshift

■ Operating temperature: 0°C to 60° C

(maximum) – heat sink or forced airflow not

required

—Automatic link speed adjustment with

poor quality cable

■ Automatic MDI crossover

—Simple thermal design

■ Power Consumption: < 1.0 Watts per port

(silicon power)

—Helps to correct for infrastructure issues

■ Advanced Cable Diagnostics

—Improved end-user troubleshooting

■ Kumeran interface

—Minimize impact of incorporating dual

Gigabit instead of Fast Ethernet

■ Leaded and lead-free^a100-pin TQFL with an

Exposed-Pad*. Devices that are lead-free are

marked with a circled “e3” and have a

product code: HYXXXXX

—Low pin count, high speed interface to the

Intel® 631xESB/632xESB I/O Controller

Hub

a.This device is lead-free. That is, lead has not been intentionally added, but lead may still exist as an impurity at <1000 ppm.

The Material Declaration Data Sheet, which includes lead impurity levels and the concentration of other Restriction on Hazard-

ous Substances (RoHS) -banned materials, is available at:

ftp://download.intel.com/design/packtech/material_content_IC_Pack

In addition, this device has been tested and conforms to the same parametric specifications as previous versions of the device.

For more information regarding lead-free products from Intel Corporation, contact your Intel Field Sales representative.

316534-004

Revision 2.9

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