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7MBR25UC120 PDF预览

7MBR25UC120

更新时间: 2024-11-11 21:03:31
品牌 Logo 应用领域
富士电机 - FUJI
页数 文件大小 规格书
5页 295K
描述
Insulated Gate Bipolar Transistor,

7MBR25UC120 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.72
Base Number Matches:1

7MBR25UC120 数据手册

 浏览型号7MBR25UC120的Datasheet PDF文件第2页浏览型号7MBR25UC120的Datasheet PDF文件第3页浏览型号7MBR25UC120的Datasheet PDF文件第4页浏览型号7MBR25UC120的Datasheet PDF文件第5页 
U-series IGBT Modules (1,200 V)  
Yuichi Onozawa  
Shinichi Yoshiwatari  
Masahito Otsuki  
1. Introduction  
tion voltage between the collector and emitter  
(VCE (sat)) and the turn-off loss of the newly developed  
IGBT (trench FS-IGBT). From this figure, it can be  
seen that the trade-off of the 1,200 V U-series IGBT is  
dramatically improved compared to that of the former  
generation S-series IGBT [planer NPT (non punch  
Power conversion equipment such as general-use  
inverters and uninterruptible power supplies (UPSs) is  
continuously challenged by demands for higher effi-  
ciency, smaller size, lower cost and lower noise.  
Accordingly, power-converting elements for inverter  
circuits are also required to have higher performance  
and lower cost. At present, IGBTs (insulated gate  
bipolar transistors) are the main power-converting  
elements used because of their low loss and easy drive  
circuit implementation. After commercializing the  
IGBT in 1988, Fuji Electric has made efforts to  
improve the IGBT in pursuit of lower loss and lower  
cost. This paper introduces fifth generation IGBT  
modules (U-series), and focuses on the 1,200 V series  
used mainly in 400 V AC power lines overseas. Adop-  
tion of a trench gate structure and a field stop (FS)  
structure has resulted in a large improvement in the  
trade-off characteristics of fifth generation IGBTs  
compared with those of the fourth generation IGBT (S-  
series).  
through) -IGBT].  
This dramatic improvement in  
characteristics has been achieved through adopting a  
field stop structure, evolved from an advanced NPT  
configuration, and a trench gate structure, acquired  
during development of MOSFETs (metal oxide semi-  
conductor field effect transistors).  
structures is described below.  
Each of these  
2.1 Field stop structure  
Figure 2 shows output characteristics and Fig. 3  
shows comparison of cross section of unit cells of a  
planar NPT-IGBT and a planar FS-IGBT. An NPT-  
IGBT requires a thick drift layer so that the depletion  
layer does not contact the collector side during turn-off.  
The FS-IGBT does not, however, require such a thick  
drift layer as the NPT because a field stop layer to stop  
the depletion layer has been fabricated in the FS-IGBT  
and accordingly VCE (sat) can be lowered for the FS-  
IGBT. Furthermore, the FS-IGBT has fewer excess  
carriers because of its thinner drift layer. Moreover,  
2. Features of the New IGBTs  
Figure 1 shows the trade-off relation of the satura-  
Fig.1 Trade-off between VCE (sat) and turn-off loss  
Fig.2 Output characteristics  
25  
160  
Room temperature  
Trench FS-IGBT  
Trench FS-IGBT 1,200 V/150 A  
VCC=600 V, IC=150 A, VG=+15 V/–15 V  
125°C  
125°C  
120  
20  
15  
10  
5
125°C  
Room  
Room  
tempe-  
temperature  
Planar  
NPT-IGBT  
rature  
125°C  
Room  
temperature  
80  
Trench  
Planar NPT-IGBT  
FS-IGBT  
40  
0
1.2  
1.4  
1.6  
1.8  
2.0  
VCE(sat) (V)  
2.2  
2.4  
2.6  
2.8  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
VCE(sat) (V)  
115  

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