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76001-0006 PDF预览

76001-0006

更新时间: 2024-01-12 22:17:20
品牌 Logo 应用领域
莫仕 - MOLEX 接线终端端子和端子排PC
页数 文件大小 规格书
2页 193K
描述
Parallel Board Spacing

76001-0006 技术参数

是否Rohs认证:符合生命周期:Active
Reach Compliance Code:compliant风险等级:2.33
Is Samacsys:N端子和端子排类型:PCB TERMINAL
Base Number Matches:1

76001-0006 数据手册

 浏览型号76001-0006的Datasheet PDF文件第2页 
Z-Power™ Connector  
10.30mm (.405”)  
FEATURES AND SPECIFICATIONS  
Parallel Board Spacing  
Z-Power is a high-current, rigid, board-to-board and wire-to-board mezzanine style interconnect  
designed to transfer power loads from one PCB to another  
Mezzanine, Board-to-Board  
and Wire-to-Board  
Applications  
Z-Power connectors utilize a unique, dual interface  
which results in long-term reliability. The Z-Power  
connector allows 50.0A to be carried between parallel  
boards in 0.232 in2, with less than .020 milliohms  
initial plane-to-plane resistance.  
The rigid nature of this interconnect allows high-density  
PCB applications to benefit from real-estate savings, by  
employing Z-Power in a dual role. Z-Power performs as  
both a high-reliability power connector and a durable  
stand-off, relieving the need for separate mechanical  
stand-offs in some applications.  
76001  
The Z-Power connector is press-fit into the PC base  
board. The PC top board is then screwed down on top  
of the Z-Power connector, forming a high-pressure  
interface. A unique, dual Hertzian contact design  
allows the screw to be installed without affecting the  
compliant-pin interface in the opposing PCB.  
Z-Power can also be used as an efficient, wire-to-board  
connector. This application is achieved through using  
standard wire-crimp, ring-lug terminals as the mating  
interface to the Z-Power screw-down terminal interface.  
Features and Benefits  
n 50.0 and 30.0A versions available to cover a  
variety of applications  
n Patented internal terminal design relieves stress on  
press-fit pins from shock and vibration  
n Low contact resistance is ideal for high-current  
n Captured internal nut provides for ease of assembly  
applications  
n Board-to-board or wire-to-board interface provides  
flexible design options  
n Compliant-pin interface provides a solderless  
termination  
30.0 and 50.0A Z-Power Connectors  
n Rigid, screw-down interface ensures a high-  
pressure, reliable contact  
SPECIFICATIONS  
Reference Information  
Packaging: Tray  
UL File No.: 1792321  
Designed In: Millimeters  
Mechanical  
Insertion Force to PCB: 9.07N (20lbf) per tail  
Recommended Torque: 0.75 N-m (6.6 Inch-lbs)  
Durability: 5 cycles mate/un-mate (bolt interface)  
Electrical  
Physical  
Voltage: 600V  
Housing: LCP  
Contact: Copper (Cu) Alloy  
Plating:  
Current at 30°C  
10 Circuit - 50.0A  
6 Circuit – 30.0A  
Contact Resistance:  
Contact Area – 30m” min. Gold (Au)  
or 100m” Tin (Sn) min.  
Solder Tail Area – 100m” min. Select Matte Tin (Sn)  
Underplating – 50m” min. Nickel (Ni)  
Beginning of Life: 10 Circuit 0.18 milliohms max.  
6 Circuit 0.30 milliohms max.  
End of Life:  
10 Circuit 0.25 milliohms max.  
6 Circuit 0.40 milliohms max.  
PCB Thickness: 2.36mm (.093”) min.  
Operating Temperature: -40 to +105°C  
Insulation Resistance: 5000 Megohms min.  

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