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75477-0001 PDF预览

75477-0001

更新时间: 2024-11-11 06:31:59
品牌 Logo 应用领域
莫仕 - MOLEX 连接器
页数 文件大小 规格书
2页 139K
描述
0.80mm (.031”) Pitch SFP Stacked Multi-Port Connectors

75477-0001 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:unknown风险等级:5.7
其他特性:12 PORTS 20 POSITIONS EACH连接器类型:TELECOM AND DATACOM CONNECTOR
联系完成配合:NOT SPECIFIED触点材料:NOT SPECIFIED
DIN 符合性:NO空壳:NO
滤波功能:NOIEC 符合性:NO
MIL 符合性:NO插接信息:MULTIPLE MATING PARTS AVAILABLE
混合触点:NO安装方式:RIGHT ANGLE
安装类型:BOARD AND PANEL选件:GENERAL PURPOSE
外壳材料:GLASS FILLED PLASTIC端接类型:PRESS FIT
触点总数:240Base Number Matches:1

75477-0001 数据手册

 浏览型号75477-0001的Datasheet PDF文件第2页 
0.80mm (.031”) Pitch  
SFP Stacked Multi-Port  
Connectors  
FEATURES AND SPECIFICATIONS  
75310, 75786, 75460, 75787,  
75462, 75640, 75759, 75714,  
75454, 75450, 75733, 75734,  
75477, 75451  
Upgrade to high-speed Ethernet and Fibre Channel ports with Molex’s Stacked  
Multi-Port SFP Connectors  
Molex is rapidly expanding its Small Form-factor  
Pluggable (SFP) product offering to meet the demands  
of networking and storage industries, which require  
denser and faster packaging for high-speed serial  
interfaces. The new SFP Stacked Multi-Port Connectors  
are the latest additions to Molex’s extensive SFP  
product line.  
These new connectors offer high port density with  
complete integration of stacked 20-circuit SFP  
connector ports within a cage. Integrated lightpipes are  
available to provide port-status indication to the user.  
The product line encompasses connectors offered in  
two heights and is available in five port configurations:  
2-by-1, 2-by-2, 2-by-4, 2-by-5 and 2-by-6.  
Molex’s SFP Stacked Multi-Port Connectors accept SFP  
MSA-compliant modules, allowing installers to  
configure and upgrade high-speed Ethernet and Fibre  
Channel (FC) ports. Tin/Lead press-fit connector tails  
are provided as the standard option. Tin-plated tails  
will also be available to meet lead-free requirements.  
Contact Molex for additional information.  
Multi-port connectors with lightpipes  
I Integrated lightpipe option, for use with mono or bi- I Connectors are available in 2 heights: medium  
Features and Benefits  
I High-speed contact design meets 4.25Gbps SFP  
requirements and is capable of speeds up to 10Gbps  
I Connectors are available in multiple port  
configurations (2, 4, 8, 10 and 12) providing  
greater port density and reduced PCB assembly  
labor  
color SMT LED’s provides port status and activity  
feedback  
25.50mm (1.000”) and tall 29.30mm (1.150”);  
Medium-height connectors meet industry standard  
and are consistent with the stacked multi-port  
modular jack design; Tall-height connector (2-by-1  
only) is designed for 1U applications  
I Modules are oriented “belly-to-belly” when inserted  
assuring ease of module removal from the port  
SPECIFICATIONS  
Reference Information  
Packaging: Tray  
UL File No.: E29179  
Mechanical  
Insertion Force to PCB: 35.59N (8 lb) per  
compliant pin, max.  
Physical  
Housing: High-temperature plastic, Glass-filled  
Contact: Tin/Brass (Sn/CuZn)  
CSA File No.: LR19980  
Mates With: SFP MSA-compliant modules  
Designed In: Millimeters  
Mating Force: 40N (8.99 lb) max.  
Unmating Force: 11.5N (2.59 lb) max.  
Durability: 100 cycles  
Plating:  
Contact Area — Gold (Au)  
Solder Tail Area — Tin/Lead (Sn/Pb) or Tin (Sn)  
Underplating — Nickel (Ni)  
Electrical  
Voltage: 120V  
Current: 0.5A max.  
PCB Thickness: 2.36mm (0.093”)  
Operating Temperature: -40 to +85°C  
Dielectric Withstanding Voltage: 300V  
Insulation Resistance: 1 Megohm  

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