1.85 by 1.85mm
Features and speciFications
(.073 by .073”) pꢀꢁꢂh GbX*
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2 ꢃꢅꢊ 3 cꢇlꢋmꢅꢉ:
75650, 75370 dꢀffꢆꢈꢆꢅꢁꢀꢃl
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ
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75670, 75660 Lꢀꢁꢆ dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ
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75676, 75666 Hybꢈꢀꢊ dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ
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75827, 75433 Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl
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75861, 75649 Lꢀꢁꢆ Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl
Hꢆꢃꢊꢆꢈꢉ
75492, 75331 Bꢃꢂkꢄlꢃꢅꢆ pꢇwꢆꢈ
Top, left to right: 75360, 75220, 75370, 75650. Bottom, left to right: 75237, 75235, 75433, 75827
2 and 3-Pair Columns add to Molex’s GbX Backplane Interconnect System Offering, Delivering
Speeds Up To 10 Gbps, High Density (Up to 69 Mated Differential Channels Per Inch) and is
Custom Configurable
4 ꢃꢅꢊ 5 cꢇlꢋmꢅꢉ:
75220, 75360 dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ
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Data rates up to 10 Gbps may now be achieved with
the GbX 2 and 3-pair column daughtercard and
backplane system. The 2 and 3-pair column system
completes the GbX product offering, making it a
complete solution for high-end telecommunication and
datacommunication applications.
solution in the near term, but also by its electrical
performance in upgradeable systems. Speeds of 10
Gbps have been demonstrated with appropriate SERDES
(Serializer/ Deserializer) devices and board-material
selection. This allows system architects freedom-of-
design for faster future systems without the worry of
backward compatibility, along with the economy of a
common backplane for two generations of equipment.
75420
4-pꢃꢀꢈ Lꢀꢁꢆ
dꢃꢋghꢁꢆꢈꢂꢃꢈꢊ
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4-pꢃꢀꢈ Hybꢈꢀꢊ
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75426
The GbX connector system provides the speed,
density, and low-applied cost required by leading-
edge backplane applications. It is especially suited
for designs that require future speed upgrades by
daughtercard replacement into an existing backplane.
In addition, the GbX Lite Series system provides a
complimentary high-density open pin field for cost-
effective design of slower-speed circuits along the same
75235, 75237 Bꢃꢂkꢄlꢃꢅꢆ sꢀgꢅꢃl
Hꢆꢃꢊꢆꢈꢉ
With native differential signaling speeds up to 10 Gbps, stiffener as the standard, high-speed GbX wafers. For
75465
4-pꢃꢀꢈ Lꢀꢁꢆ Bꢃꢂkꢄlꢃꢅꢆ
sꢀgꢅꢃl Hꢆꢃꢊꢆꢈ
GbX is well suited for existing and future generations
of XAUI (10 Gigabit Attachment Unit Interface) and
InfiniBand† based systems, in addition to those based
on ATCA‡ (Advanced Telecom Computing Architecture)
and OIF (Optical Internetworking Forum) chip
protocols.
more information on Molex’s extensive GbX offering,
please visit: www.molex.com/product/backplan/gbx.
html.
75341, 75510 Bꢃꢂkꢄlꢃꢅꢆ pꢇwꢆꢈ
*GbX and VHDM-HSD are registered trademarks of Amphenol
Corporation
†InfiniBand is a registered trademark of the InfiniBand Trade
Association
‡ATCA is a trademark of the PCI Industrial Manufacturers
Group
sꢁꢃꢅꢊ-alꢇꢅꢆ Gꢋꢀꢊꢆ pꢀꢅ Kꢀꢁ:
75234
Internetworking and telecommunication equipment
engineers will benefit by the GbX connector’s ability
to provide not only a high-density, low applied-cost
Features and Benefits
n
n
n
Up to 69 real differential pairs per linear inch (27
Modular daughtercard components with GbX
L-Series available with custom, cost-effective
receptacle assemblies
Data rate options up to 10 Gbps are able to support
future daughtercard speed upgrades
real differential pairs per 10.00mm (.393”) offers
high density with more differential pairs per linear
inch than VHDM-HSD*
n
Optimized differential pair contacts for easier
board trace routing
n
Bifurcated contact beams in daughtercard
receptacle provide greater reliability with two
points of contact to header pin
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