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74VCXH16244MTDX PDF预览

74VCXH16244MTDX

更新时间: 2024-11-05 23:24:35
品牌 Logo 应用领域
其他 - ETC 逻辑集成电路光电二极管驱动
页数 文件大小 规格书
10页 143K
描述
BUFFER/DRIVER|QUAD|4-BIT|VCX-CMOS|TSSOP|48PIN|PLASTIC

74VCXH16244MTDX 数据手册

 浏览型号74VCXH16244MTDX的Datasheet PDF文件第2页浏览型号74VCXH16244MTDX的Datasheet PDF文件第3页浏览型号74VCXH16244MTDX的Datasheet PDF文件第4页浏览型号74VCXH16244MTDX的Datasheet PDF文件第5页浏览型号74VCXH16244MTDX的Datasheet PDF文件第6页浏览型号74VCXH16244MTDX的Datasheet PDF文件第7页 
November 1999  
Revised March 2002  
74VCXH16244  
Low Voltage 16-Bit Buffer/Line Driver with Bushold  
General Description  
The VCXH16244 contains sixteen non-inverting buffers  
with 3-STATE outputs to be employed as a memory and  
Features  
1.4V to 3.6V VCC supply operation  
address driver, clock driver, or bus oriented transmitter/  
receiver. The device is nibble (4-bit) controlled. Each nibble  
has separate 3-STATE control inputs which can be shorted  
together for full 16-bit operation.  
3.6V tolerant control inputs and outputs  
Bushold on data inputs eliminating the need for external  
pull-up/pull-down resistors  
The VCXH16244 data inputs include active bushold cir-  
cuitry, eliminating the need for external pull-up resistors to  
hold unused or floating data inputs at a valid logic level.  
tPD  
2.5 ns max for 3.0V to 3.6V VCC  
The 74VCXH16244 is designed for low voltage (1.4V to  
3.6V) VCC applications with output capability up to 3.6V.  
Static Drive (IOH/IOL  
)
±24 mA @ 3.0V VCC  
The 74VCXH16244 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing low CMOS power dissipation.  
Uses patented noise/EMI reduction circuitry  
Latch-up performance exceeds 300 mA  
ESD performance:  
Human body model > 2000V  
Machine model > 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74VCXH16244GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74VCXH16244MTD  
(Note 2)  
MTD48  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Logic Symbol  
© 2002 Fairchild Semiconductor Corporation  
DS500230  
www.fairchildsemi.com  

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