是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | FLIP-CHIP, 4 PIN | 针数: | 4 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 8.01 | Is Samacsys: | N |
系列: | TTL/H/L | JESD-30 代码: | S-PBGA-B4 |
JESD-609代码: | e1 | 长度: | 1.07 mm |
负载电容(CL): | 50 pF | 逻辑集成电路类型: | INVERTER |
最大I(ol): | 0.024 A | 功能数量: | 1 |
输入次数: | 1 | 端子数量: | 4 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA4,2X2,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 包装方法: | TAPE AND REEL |
峰值回流温度(摄氏度): | 260 | 电源: | 3.3 V |
Prop。Delay @ Nom-Sup: | 6.5 ns | 传播延迟(tpd): | 11.5 ns |
认证状态: | Not Qualified | 施密特触发器: | NO |
座面最大高度: | 0.715 mm | 子类别: | Gates |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.65 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 1.07 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
SN74AUP1G14YFPR | TI |
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