March 1999
Revised March 2005
74LVT574 • 74LVTH574
Low Voltage Octal D-Type Flip-Flop
with 3-STATE Outputs
General Description
Features
■ Input and output interface capability to systems at
The LVT574 and LVTH574 are high-speed, low-power
octal D-type flip-flop featuring separate D-type inputs for
each flip-flop and 3-STATE outputs for bus-oriented appli-
cations. A buffered Clock (CP) and Output Enable (OE) are
common to all flip-flops.
5V VCC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH574),
also available without bushold feature (74LVT574)
The LVTH574 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
These octal flip-flops are designed for low-voltage (3.3V)
VCC applications, but with the capability to provide a TTL
■ Outputs source/sink 32 mA/ 64 mA
■ Functionally compatible with the 74 series 574
■ Latch-up performance exceeds 500 mA
■ ESD performance:
interface to a 5V environment. The LVT574 and LVTH574
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Human-body model 2000V
Machine model 200V
Charged-device model 1000V
Ordering Code:
Package
Order Number
Package Description
Number
74LVT574WM
74LVT574SJ
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVT574MSA
74LVT574MTC
MSA20
MTC20
MTC20
74LVT574MTCX_NL
(Note 1)
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH574WM
74LVTH574SJ
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH574MSA
74LVTH574MTC
MSA20
MTC20
MTC20
74LVTH574MTCX_NL
(Note 1)
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS012451
www.fairchildsemi.com