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74LVTH373MTCX-NL PDF预览

74LVTH373MTCX-NL

更新时间: 2024-09-16 05:05:51
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 锁存器
页数 文件大小 规格书
8页 101K
描述
Low Voltage Octal Transparent Latch with 3-STATE Outputs

74LVTH373MTCX-NL 数据手册

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September 1999  
Revised March 2005  
74LVT373 74LVTH373  
Low Voltage Octal Transparent Latch  
with 3-STATE Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT373 and LVTH373 consist of eight latches with  
3-STATE outputs for bus organized system applications.  
The latches appear transparent to the data when Latch  
Enable (LE) is HIGH. When LE is LOW, the data satisfying  
the input timing requirements is latched. Data appears on  
the bus when the Output Enable (OE) is LOW. When OE is  
HIGH, the bus output is in a high impedance state.  
5V VCC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH373),  
also available without bushold feature (74LVT373)  
Live insertion/extraction permitted  
Power Up/Down high impedance provides glitch-free  
bus loading  
The LVTH373 data inputs include bushold, eliminating the  
need for external pull-up resistors to hold unused inputs.  
Outputs source/sink 32 mA/ 64 mA  
Functionally compatible with the 74 series 373  
ESD performance:  
These octal latches are designed for low-voltage (3.3V)  
VCC applications, but with the capability to provide a TTL  
interface to a 5V environment. The LVT373 and LVTH373  
are fabricated with an advanced BiCMOS technology to  
achieve high speed operation similar to 5V ABT while  
maintaining low power dissipation.  
Human-body model 2000V  
Machine model 200V  
Charged-device model 1000V  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LVT373WM  
74LVT373SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74LVT373MTC  
74LVTH373WM  
74LVTH373SJ  
74LVTH373MTC  
MTC20  
M20B  
M20D  
MTC20  
MTC20  
74LVTH373MTCX_NL  
(Note 1)  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
Logic Symbols  
IEEE/IEC  
© 2005 Fairchild Semiconductor Corporation  
DS012015  
www.fairchildsemi.com  

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