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74LVTH32245EC PDF预览

74LVTH32245EC

更新时间: 2024-11-25 05:05:51
品牌 Logo 应用领域
恩智浦 - NXP 总线驱动器总线收发器逻辑集成电路信息通信管理
页数 文件大小 规格书
13页 93K
描述
3.3 V 32-bit bus transceiver; 3-state

74LVTH32245EC 技术参数

Source Url Status Check Date:2013-06-14 00:00:00是否无铅: 含铅
是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA, BGA96,6X16,32
针数:96Reach Compliance Code:not_compliant
HTS代码:8542.39.00.01风险等级:5.42
Is Samacsys:N控制类型:COMMON CONTROL
计数方向:BIDIRECTIONAL系列:LVT
JESD-30 代码:R-PBGA-B96JESD-609代码:e0
长度:13.5 mm逻辑集成电路类型:BUS TRANSCEIVER
最大I(ol):0.064 A湿度敏感等级:4
位数:8功能数量:4
端口数量:2端子数量:96
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA96,6X16,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):240
电源:3.3 VProp。Delay @ Nom-Sup:3.3 ns
传播延迟(tpd):3.5 ns认证状态:Not Qualified
座面最大高度:1.5 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:BICMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn63Pb37)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:5.5 mm
Base Number Matches:1

74LVTH32245EC 数据手册

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74LVTH32245  
3.3 V 32-bit bus transceiver; 3-state  
Rev. 01 — 23 January 2008  
Product data sheet  
1. General description  
The 74LVTH32245 is a high-performance BiCMOS product designed for VCC operation at  
3.3 V. The 74LVTH32245 is a 32-bit transceiver featuring non-inverting 3-state bus  
compatible outputs in both send and receive directions. The device features four output  
enable (nOE) inputs for easy cascading and four send/receive (nDIR) inputs for direction  
control. Pin nOE controls the outputs so that the buses are effectively isolated. Bus hold  
on data inputs eliminates the need for external pull-up resistors to hold unused inputs.  
2. Features  
I 32-bit bidirectional bus interface  
I 3-state buffers  
I Output capability: +64 mA and 32 mA  
I TTL input and output switching levels  
I Input and output interface capability to systems at 5 V supply  
I Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs  
I Live insertion and extraction permitted  
I Power-up 3-state  
I No bus current loading when output is tied to 5 V bus  
I Latch-up protection:  
N JESD78 Class II level A exceeds 500 mA  
I ESD protection:  
N HBM JESD22-A114E exceeds 2000 V  
N MM JESD22-A115-A exceeds 200 V  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVTH32245EC  
40 °C to +85 °C  
LFBGA96 plastic low profile fine-pitch ball grid array package; SOT536-1  
96 balls; body 13.5 × 5.5 × 1.05 mm  

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