November 1999
Revised March 2005
74LVT2245 • 74LVTH2245
Low Voltage Octal Bidirectional Transceiver with
3-STATE Inputs/Outputs and 25: Series Resistors
in the B Port Outputs
General Description
Features
■ Input and output interface capability to systems at
The LVT2245 and LVTH2245 contain eight non-inverting
bidirectional buffers with 3-STATE outputs and are
intended for bus-oriented applications. The Transmit/
Receive (T/R) input determines the direction of data flow
through the bidirectional transceiver. Transmit (active-
HIGH) enables data from A Ports to B Ports; Receive
(active-LOW) enables data from B Ports to A Ports. The
Output Enable input, when HIGH, disables both A and B
Ports by placing them in a high impedance state. The
equivalent 25 -series resistor in the B Port helps reduce
output overshoot and undershoot.
5V VCC
■ Equivalent 25 series resistor on B Port outputs
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH2245),
also available without bushold feature (74LVT2245)
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink 12 mA/ 12 mA on B Port,
The LVTH2245 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
32 mA/ 64 mA on A Port
■ Latch-up performance exceeds 500 mA
■ ESD performance:
These transceivers are designed for low voltage (3.3V)
VCC applications, but with the capability to provide a TTL
Human-body model 2000V
Machine model 200V
interface to
a 5V environment. The LVT2245 and
LVTH2245 are fabricated with an advanced BiCMOS tech-
nology to achieve high speed operation similar to 5V ABT
while maintaining low power dissipation.
Charged-device model 1000V
Ordering Code:
Package
Order Number
Package Description
Number
74LVT2245WM
74LVT2245SJ
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVT2245MSA
74LVT2245MTC
MSA20
MTC20
MTC20
74LVT2245MTCX_NL
(Note 1)
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH2245WM
74LVTH2245SJ
74LVTH2245MSA
74LVTH2245MTC
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MSA20
MTC20
MTC20
74LVTH2245MTCX_NL
(Note 1)
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS012173
www.fairchildsemi.com