July 1999
Revised March 2005
74LVT2244 • 74LVTH2244
Low Voltage Octal Buffer/Line Driver
with 3-STATE Outputs
and 25: Series Resistors in the Outputs
General Description
Features
■ Input and output interface capability to systems at
The LVT2244 and LVTH2244 are octal buffers and line
drivers designed to be employed as memory address driv-
ers, clock drivers and bus oriented transmitters or receivers
which provides improved PC board density. The equivalent
25 -Series resistors helps reduce output overshoot and
undershoot.
5V VCC
■ Equivalent 25 -Series resistors on outputs
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH2244),
also available without bushold feature (74LVT2244).
The LVTH2244 data inputs include bushold, eliminating the
need for external pull-up resistors to hold unused inputs.
■ Live insertion/extraction permitted
■ Power Up/Down high impedance provides glitch-free
bus loading
These octal buffers and line drivers are designed for low-
voltage (3.3V) VCC applications, but with the capability to
■ Outputs source/sink 12 mA/ 12 mA
■ Latch-up performance exceeds 500 mA
■ ESD performance:
provide a TTL interface to a 5V environment. The LVT2244
and LVTH2244 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Human-body model 2000V
Machine model 200V
Charged-device model 1000V
Ordering Code:
Package
Order Number
Package Description
Number
74LVT2244WM
74LVT2244SJ
74LVT2244MTC
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MTC20
MTC20
74LVT2244MTCX_NL
(Note 1)
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH2244WM
74LVTH2244SJ
74LVTH2244MTC
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MTC20
MTC20
74LVTH2244MTCX_NL
(Note 1)
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS012170
www.fairchildsemi.com