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74LVTH162244

更新时间: 2024-11-10 22:56:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器
页数 文件大小 规格书
8页 96K
描述
Low Voltage 16-Bit Buffer/Line Driver with 3-STATE Outputs and 25? Series Resistors in the Outputs

74LVTH162244 数据手册

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March 1999  
Revised June 2005  
74LVT162244 74LVTH162244  
Low Voltage 16-Bit Buffer/Line Driver  
with 3-STATE Outputs  
and 25: Series Resistors in the Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT162244 and LVTH162244 contain sixteen non-  
inverting buffers with 3-STATE outputs designed to be  
employed as a memory and address driver, clock driver, or  
bus oriented transmitter/receiver. The device is nibble con-  
trolled. Individual 3-STATE control inputs can be shorted  
together for 8-bit or 16-bit operation.  
5V VCC  
Bushold data inputs eliminate the need for external pull-  
up resistors to hold unused inputs (74LVTH162244),  
also available without bushold feature (74LVT162244).  
Live insertion/extraction permitted  
The LVT162244 and LVTH162244 are designed with  
equivalent 25 series resistance in both the HIGH and  
LOW states of the output. This design reduces line noise in  
applications such as memory address drivers, clock driv-  
ers, and bus transceivers/transmitters.  
Power Up/Power Down high impedance provides glitch-  
free bus loading  
Outputs include equivalent series resistance of 25 to  
make external termination resistors unnecessary and  
reduce overshoot and undershoot  
The LVTH162244 data inputs include bushold, eliminating  
the need for external pull-up resistors to hold unused  
inputs.  
Functionally compatible with the 74 series 162244  
Latch-up performance exceeds 500 mA  
ESD performance:  
These buffers and line drivers are designed for low-voltage  
(3.3V) VCC applications, but with the capability to provide a  
Human-body model 2000V  
TTL interface to a 5V environment. The LVT162244 and  
LVTH162244 are fabricated with an advanced BiCMOS  
technology to achieve high speed operation similar to 5V  
ABT while maintaining a low power dissipation.  
Machine model 200V  
Charged-device 1000V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA)  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LVT162244G  
(Note 1)(Note 2)  
BGA54A  
MS48A  
MTD48  
BGA54A  
MS48A  
MS48A  
MTD48  
MTD48  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
74LVT162244MEA  
(Note 2)  
74LVT162244MTD  
(Note 2)  
74LVTH162244G  
(Note 1)(Note 2)  
74LVTH162244MEA  
74LVTH162244MEX  
74LVTH162244MTD  
74LVTH162244MTX  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
[Tube]  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
[Tape and Reel]  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
[Tube]  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
[Tape and Reel]  
Note 1: Ordering code “G” indicates Trays.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
© 2005 Fairchild Semiconductor Corporation  
DS012445  
www.fairchildsemi.com  

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