Datasheet > 74LVT374MTC_08

74LVT374MTC_08

更新时间： 2022-04-07 11:32:08

品牌	Logo	应用领域
飞兆/仙童 - FAIRCHILD		触发器
页数	文件大小	规格书
10页	314K
描述
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

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74LVT374MTC_08 数据手册

January 2008

74LVT374, 74LVTH374

Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

Features

General Description

■ Input and output interface capability to systems at

The LVT374 and LVTH374 are high-speed, low-power

octal D-type flip-flops featuring separate D-type inputs

for each flip-flop and 3-STATE outputs for bus-oriented

applications. A buffered Clock (CP) and Output Enable

(OE) are common to all flip-flops.

5V V

■ Bus-Hold data inputs eliminate the need for external

pull-up resistors to hold unused inputs (74LVTH374),

also available without bushold feature (74LVT374)

■ Live insertion/extraction permitted

The LVTH374 data inputs include bushold, eliminating

the need for external pull-up resistors to hold unused

inputs.

■ Power Up/Down high impedance provides glitch-free

bus loading

■ Outputs source/sink –32mA/+64mA

■ Functionally compatible with the 74 series 374

■ Latch-up performance exceeds 500mA

■ ESD performance:

These octal flip-flops are designed for low-voltage (3.3V)

applications, but with the capability to provide a TTL

interface to a 5V environment. The LVT374 and

LVTH374 are fabricated with an advanced BiCMOS

technology to achieve high speed operation similar to 5V

ABT while maintaining low power dissipation.

– Human-body model > 2000V

– Machine model > 200V

– Charged-device model > 1000V

Ordering Information

Package

Order Number

74LVT374WM

74LVT374SJ

Number

Package Description

M20B

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

M20D

74LVT374MTC

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

74LVTH374WM

74LVTH374SJ

74LVTH374MTC

M20B

M20D

20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide

20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

MTC20

20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm

Wide

Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.

All packages are lead free per JEDEC: J-STD-020B standard.

74LVT374, 74LVTH374 Rev. 1.5.0

www.fairchildsemi.com

12 3 4 5 6 7...10

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