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74LVT374 PDF预览

74LVT374

更新时间: 2024-11-24 22:56:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 触发器
页数 文件大小 规格书
8页 102K
描述
Low Voltage Octal D-Type Flip-Flop with 3-STATE Outputs

74LVT374 数据手册

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September 1999  
Revised March 2005  
74LVT374 74LVTH374  
Low Voltage Octal D-Type Flip-Flop  
with 3-STATE Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT374 and LVTH374 are high-speed, low-power  
octal D-type flip-flops featuring separate D-type inputs for  
each flip-flop and 3-STATE outputs for bus-oriented appli-  
cations. A buffered Clock (CP) and Output Enable (OE) are  
common to all flip-flops.  
5V VCC  
Bus-Hold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH374),  
also available without bushold feature (74LVT374).  
The LVTH374 data inputs include bushold, eliminating the  
need for external pull-up resistors to hold unused inputs.  
Live insertion/extraction permitted  
Power Up/Down high impedance provides glitch-free  
bus loading  
These octal flip-flops are designed for low-voltage (3.3V)  
VCC applications, but with the capability to provide a TTL  
Outputs source/sink 32 mA/ 64 mA  
Functionally compatible with the 74 series 374  
Latch-up performance exceeds 500 mA  
ESD performance:  
interface to a 5V environment. The LVT374 and LVTH374  
are fabricated with an advanced BiCMOS technology to  
achieve high speed operation similar to 5V ABT while  
maintaining low power dissipation.  
Human-body model 2000V  
Machine model 200V  
Charged-device model 1000V  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LVT374WM  
74LVT374SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74LVT374MTC  
74LVTH374WM  
74LVTH374SJ  
74LVTH374MTC  
MTC20  
M20B  
M20D  
MTC20  
MTC20  
74LVTH374MTCX_NL  
(Note 1)  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
IEEE/IEC  
Logic Symbols  
© 2005 Fairchild Semiconductor Corporation  
DS012016  
www.fairchildsemi.com  

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