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74LVT2240 PDF预览

74LVT2240

更新时间: 2024-10-29 22:56:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器
页数 文件大小 规格书
6页 80K
描述
Low Voltage Inverting Octal Buffer/Line Driver with 3-STATE Outputs

74LVT2240 数据手册

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July 1999  
Revised August 1999  
74LVT2240 • 74LVTH2240  
Low Voltage Inverting Octal Buffer/Line Driver  
with 3-STATE Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT2240 and LVTH2240 are inverting octal buffers  
and line drivers designed to be employed as memory  
address drivers, clock drivers and bus oriented transmitters  
or receivers which provides improved PC board density.  
The equivalent 25-Series resistors helps reduce output  
overshoot and undershoot.  
5V VCC  
Equivalent 25-Series resistors on outputs  
Bushold data inputs eliminate the need for external pull-  
up resistors to hold unused inputs (74LVTH2240), also  
available without bushold feature (74LVT2240).  
The LVTH2240 data inputs include bushold, eliminating the  
need for external pull-up resistors to hold unused inputs.  
Live insertion/extraction permitted  
Power Up/Down high impedance provides glitch-free  
bus loading  
These inverting octal buffers and line drivers are designed  
for low-voltage (3.3V) VCC applications, but with the capa-  
Outputs source/sink 12 mA/+12 mA  
Latch-up performance exceeds 500 mA  
bility to provide a TTL interface to a 5V environment. The  
LVT2240 and LVTH2240 are fabricated with an advanced  
BiCMOS technology to achieve high speed operation simi-  
lar to 5V ABT while maintaining low power dissipation.  
Ordering Code:  
Order Number  
74LVT2240WM  
74LVT2240SJ  
Package Number  
M20B  
Package Description  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
M20D  
74LVT2240MTC  
74LVTH2240WM  
74LVTH2240SJ  
74LVTH2240MTC  
MTC20  
M20B  
M20D  
MTC20  
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Logic Symbol  
Connection Diagram  
IEEE/IEC  
© 1999 Fairchild Semiconductor Corporation  
DS500212  
www.fairchildsemi.com  

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