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74LVT16374 PDF预览

74LVT16374

更新时间: 2024-09-14 22:56:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 触发器
页数 文件大小 规格书
8页 101K
描述
Low Voltage 16-Bit D-Type Flip-Flop with 3-STATE Outputs

74LVT16374 数据手册

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January 1999  
Revised June 2005  
74LVT16374 74LVTH16374  
Low Voltage 16-Bit D-Type Flip-Flop  
with 3-STATE Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT16374 and LVTH16374 contain sixteen non-invert-  
ing D-type flip-flops with 3-STATE outputs and is intended  
for bus oriented applications. The device is byte controlled.  
A buffered clock (CP) and Output Enable (OE) are com-  
mon to each byte and can be shorted together for full 16-bit  
operation.  
5V VCC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH16374),  
also available without bushold feature (74LVT16374)  
Live insertion/extraction permitted  
The LVTH16374 data inputs include bushold, eliminating  
the need for external pull-up resistors to hold unused  
inputs.  
Power Up/Power Down high impedance provides  
glitch-free bus loading  
Outputs source/sink 32 mA/ 64 mA  
Functionally compatible with the 74 series 16374  
Latch-up performance exceeds 500 mA  
ESD performance:  
These flip-flops are designed for low-voltage (3.3V) VCC  
applications, but with the capability to provide a TTL inter-  
face to a 5V environment. The LVT16374 and LVTH16374  
are fabricated with an advanced BiCMOS technology to  
achieve high speed operation similar to 5V ABT while  
maintaining a low power dissipation.  
Human-body model 2000V  
Machine model 200V  
Charged-device model 1000V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA)  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74LVT16374G  
BGA54A  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
(Note 1)(Note 2)  
(Preliminary)  
74LVT16374MEA  
(Note 2)  
MS48A  
MTD48  
BGA54A  
MS48A  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
74LVT16374MTD  
(Note 2)  
74LVTH16374G  
(Note 1)(Note 2)  
74LVTH16374MEA  
(Note 2)  
74LVTH16374MTD  
(Note 2)  
Note 1: Ordering code “G” indicates Trays.  
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Logic Symbol  
© 2005 Fairchild Semiconductor Corporation  
DS012022  
www.fairchildsemi.com  

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