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74LVT16373 PDF预览

74LVT16373

更新时间: 2024-11-17 22:34:43
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 锁存器
页数 文件大小 规格书
8页 100K
描述
Low Voltage 16-Bit Transparent Latch with 3-STATE Outputs

74LVT16373 数据手册

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January 1999  
Revised June 2005  
74LVT16373 74LVTH16373  
Low Voltage 16-Bit Transparent Latch  
with 3-STATE Outputs  
General Description  
Features  
Input and output interface capability to systems at  
The LVT16373 and LVTH16373 contain sixteen non-invert-  
ing latches with 3-STATE outputs and is intended for bus  
oriented applications. The device is byte controlled. The  
flip-flops appear transparent to the data when the Latch  
Enable (LE) is HIGH. When LE is LOW, the data that meets  
the setup time is latched. Data appears on the bus when  
the Output Enable (OE) is LOW. When OE is HIGH, the  
outputs are in a high impedance state.  
5V VCC  
Bushold data inputs eliminate the need for external  
pull-up resistors to hold unused inputs (74LVTH16373),  
also available without bushold feature (74LVT16373)  
Live insertion/extraction permitted  
Power Up/Power Down high impedance provides  
glitch-free bus loading  
The LVTH16373 data inputs include bushold, eliminating  
the need for external pull-up resistors to hold unused  
inputs.  
Outputs source/sink 32 mA/ 64 mA  
Functionally compatible with the 74 series 16373  
Latch-up performance exceeds 500 mA  
ESD performance:  
These latches are designed for low-voltage (3.3V) VCC  
applications, but with the capability to provide a TTL inter-  
face to a 5V environment. The LVT16373 and LVTH16373  
are fabricated with an advanced BiCMOS technology to  
achieve high speed operation similar to 5V ABT while  
maintaining a low power dissipation.  
Human-body model 2000V  
Machine model 200V  
Charged-device model 1000V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74LVT16373GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74LVT16373MEA  
(Note 2)  
MS48A  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
74LVT16373MTD  
(Note 2)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
74LVTH16373GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74LVTH16373MEA  
(Note 2)  
MS48A  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
74LVTH16373MTD  
(Note 2)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Logic Symbol  
© 2005 Fairchild Semiconductor Corporation  
DS012021  
www.fairchildsemi.com  

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