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74LVT16244BBQ PDF预览

74LVT16244BBQ

更新时间: 2024-12-01 06:31:55
品牌 Logo 应用领域
恩智浦 - NXP 总线驱动器总线收发器逻辑集成电路信息通信管理
页数 文件大小 规格书
18页 169K
描述
3.3 V 16-bit buffer/driver; 3-state

74LVT16244BBQ 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFN包装说明:VBCC,
针数:60Reach Compliance Code:compliant
风险等级:5.83Is Samacsys:N
系列:LVTJESD-30 代码:R-PBCC-B60
长度:6 mm逻辑集成电路类型:BUS DRIVER
位数:4功能数量:4
端口数量:2端子数量:60
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:VBCC
封装形状:RECTANGULAR封装形式:CHIP CARRIER, VERY THIN PROFILE
传播延迟(tpd):4 ns认证状态:Not Qualified
座面最大高度:0.6 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子形式:BUTT
端子节距:0.5 mm端子位置:BOTTOM
宽度:4 mmBase Number Matches:1

74LVT16244BBQ 数据手册

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74LVT16244B; 74LVTH16244B  
3.3 V 16-bit buffer/driver; 3-state  
Rev. 08 — 22 March 2010  
Product data sheet  
1. General description  
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for  
CC operation at 3.3 V.  
V
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.  
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.  
2. Features and benefits  
„ 16-bit bus interface  
„ 3-state buffers  
„ Output capability: +64 mA and 32 mA  
„ TTL input and output switching levels  
„ Input and output interface capability to systems at 5 V supply  
„ Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs  
„ Power-up 3-state  
„ Live insertion and extraction permitted  
„ No bus current loading when output is tied to 5 V bus  
„ Latch-up protection  
‹ JESD78B Class II exceeds 500 mA  
„ ESD protection:  
‹ HBM JESD22-A114F exceeds 2000 V  
‹ MM JESD22-A115-A exceeds 200 V  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVT16244BDL  
74LVTH16244BDL  
74LVT16244BDGG  
74LVTH16244BDGG  
74LVT16244BEV  
40 °C to +85 °C  
SSOP48  
plastic shrink small outline package; 48 leads; SOT370-1  
body width 7.5 mm  
40 °C to +85 °C  
TSSOP48  
VFBGA56  
plastic thin shrink small outline package;  
48 leads; body width 6.1 mm  
SOT362-1  
40 °C to +85 °C  
40 °C to +85 °C  
plastic very thin fine-pitch ball grid array  
SOT702-1  
package; 56 balls; body 4.5 × 7 × 0.65 mm  
74LVT16244BBQ  
74LVTH16244BBQ  
HXQFN60U plastic thermal enhanced extremely thin quad  
flat package; no leads; 60 terminals; UTLP  
based; body 4 × 6 × 0.5 mm  
SOT1134-1  

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