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74LVC2G07MDCKTEPG4 PDF预览

74LVC2G07MDCKTEPG4

更新时间: 2024-11-27 12:48:15
品牌 Logo 应用领域
德州仪器 - TI 驱动器栅极触发器逻辑集成电路光电二极管输出元件PC
页数 文件大小 规格书
11页 310K
描述
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

74LVC2G07MDCKTEPG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:TSSOP, TSSOP6,.08针数:6
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.72Samacsys Confidence:
Samacsys Status:ReleasedSamacsys PartID:605121
Samacsys Pin Count:6Samacsys Part Category:Integrated Circuit
Samacsys Package Category:OtherSamacsys Footprint Name:SOT65P210X110-6N
Samacsys Released Date:2017-01-12 12:59:53Is Samacsys:N
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G6
JESD-609代码:e4长度:2 mm
负载电容(CL):50 pF逻辑集成电路类型:BUFFER
最大I(ol):0.032 A湿度敏感等级:1
功能数量:2输入次数:1
端子数量:6最高工作温度:125 °C
最低工作温度:-55 °C输出特性:OPEN-DRAIN
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP6,.08封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TR
峰值回流温度(摄氏度):260电源:3.3 V
最大电源电流(ICC):0.01 mAProp。Delay @ Nom-Sup:5.7 ns
传播延迟(tpd):5.7 ns认证状态:Not Qualified
施密特触发器:NO座面最大高度:1.1 mm
子类别:Gates最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.25 mmBase Number Matches:1

74LVC2G07MDCKTEPG4 数据手册

 浏览型号74LVC2G07MDCKTEPG4的Datasheet PDF文件第2页浏览型号74LVC2G07MDCKTEPG4的Datasheet PDF文件第3页浏览型号74LVC2G07MDCKTEPG4的Datasheet PDF文件第4页浏览型号74LVC2G07MDCKTEPG4的Datasheet PDF文件第5页浏览型号74LVC2G07MDCKTEPG4的Datasheet PDF文件第6页浏览型号74LVC2G07MDCKTEPG4的Datasheet PDF文件第7页 
SN74LVC2G07-EP  
www.ti.com ....................................................................................................................................................................................................... SCES719MAY 2008  
DUAL BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUTS  
1
FEATURES  
Controlled Baseline  
Inputs and Open-Drain Outputs Accept  
Voltages up to 5.5 V  
One Assembly Site  
One Test Site  
Max tpd of 5.7 ns at 3.3 V  
Low Power Consumption, 10 µA Max ICC  
±24-mA Output Drive at 3.3 V  
One Fabrication Site  
Extended Temperature Performance of –55°C  
to 125°C  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
Enhanced Product-Change Notification  
(1)  
Ioff Supports Partial-Power-Down Mode  
Operation  
Qualification Pedigree  
Supports 5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
1000-V Charged-Device Model (C101)  
DCK PACKAGE  
(TOP VIEW)  
1A  
GND  
2A  
1
2
3
6
5
4
1Y  
VCC  
2Y  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open  
drain and can be connected to other open-drain outputs to implement active low wired OR or active high wired  
AND functions. The maximum sink current is 32 mA.  
This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
CHC  
–55°C to 125°C SOT (SC-70) – DCK  
Reel of 250  
SN74LVC2G07MDCKTEP  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

74LVC2G07MDCKTEPG4 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC2G07MDCKTEP TI

完全替代

Enhanced Product Dual Buffer/Driver with Open-Drain Output 6-SC70 -55 to 125

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