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74LVC1GU04DBVRG4 PDF预览

74LVC1GU04DBVRG4

更新时间: 2024-11-27 05:05:51
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
16页 643K
描述
SINGLE INVERTER GATE

74LVC1GU04DBVRG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOT-23
包装说明:LSSOP, TSOP5/6,.11,37针数:5
Reach Compliance Code:compliantHTS代码:8542.39.00.01
Factory Lead Time:6 weeks风险等级:1.03
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G5
JESD-609代码:e4长度:2.9 mm
负载电容(CL):50 pF逻辑集成电路类型:INVERTER
最大I(ol):0.032 A湿度敏感等级:1
功能数量:1输入次数:1
端子数量:5最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP封装等效代码:TSOP5/6,.11,37
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
包装方法:TR峰值回流温度(摄氏度):260
电源:3.3 V最大电源电流(ICC):0.01 mA
Prop。Delay @ Nom-Sup:4.2 ns传播延迟(tpd):5 ns
认证状态:Not Qualified施密特触发器:NO
座面最大高度:1.45 mm子类别:Gates
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.95 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:1.6 mm
Base Number Matches:1

74LVC1GU04DBVRG4 数据手册

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SN74LVC1GU04  
SINGLE INVERTER GATE  
www.ti.com  
SCES215TAPRIL 1999REVISED JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
±24-mA Output Drive at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Unbuffered Output  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Max tpd of 3.7 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
VCC  
1
2
3
5
VCC  
NC  
A
1
2
3
5
NC  
A
VCC  
1
2
3
5
4
NC  
A
4
GND  
Y
4
GND  
Y
GND  
Y
YZP PACKAGE  
(BOTTOM VIEW)  
YZV PACKAGE  
(BOTTOM VIEW)  
2
1
3
4
3
2
1
4
GND  
A
Y
GND  
Y
A
VCC  
5
VCC  
DNU  
See mechanical drawings for dimensions.  
NC – No internal connection  
DNU – Do not use  
DESCRIPTION/ORDERING INFORMATION  
This single inverter gate is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1GU04 contains one inverter with an unbuffered output and performs the Boolean function Y = A.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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