August 1998
Revised June 2005
74LCXR162245
Low Voltage 16-Bit Bidirectional Transceiver
with 5V Tolerant Inputs/Outputs
and 26: Series Resistors in the Outputs
General Description
Features
■ 5V tolerant inputs and outputs
The LCXR162245 contains sixteen non-inverting bidirec-
tional buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is designed for low volt-
age (2.5V or 3.3V) VCC applications with capability of inter-
■ 2.3V–3.6V VCC specifications provided
■ A and B side outputs have equivalent 26 series
resistors
facing to a 5V signal environment. The device is byte
controlled. Each byte has separate control inputs which
could be shorted together for full 16-bit operation. The T/R
inputs determine the direction of data flow through the
device. The OE inputs disable both the A and B ports by
placing them in a high impedance state.
■ 5.3 ns tPD max (VCC 3.3V), 20 A ICC max
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
■ Flow through pinout
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
In addition, all A and B outputs include equivalent 26
(nominal) series resistors to reduce overshoot and under-
shoot and are designed to sink/source up to 12 mA at
VCC 3.0V.
Human body model 2000V
The LCXR162245 is fabricated with an advanced CMOS
technology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Machine model 200V
Note 1: To ensure the high-impedance state during power up or down OE
should be tied to V
through a pull-up resistor: the minimum value or the
CC
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Order Number
Package Number
Package Description
74LCXR162245MEA
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[RAIL]
74LCXR162245MEX
74LCXR162245MTD
74LCXR162245MTX
MS48A
MTD48
MTD48
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
[TAPE and REEL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[RAIL]
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
[TAPE and REEL]
Devices also available in Tape and Reel. Specify by appending the suffix letter “x” to the ordering code.
Logic Symbol
Pin Descriptions
Pin Names
Description
Output Enable Input
OEn
T/Rn
Transmit/Receive Input
A0–A15
B0–B15
Side A Inputs or 3-STATE Outputs
Side B Inputs or 3-STATE Outputs
© 2005 Fairchild Semiconductor Corporation
DS500052
www.fairchildsemi.com
Print form created on June 10, 2005 12:56 pm