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74LCXH162374GX PDF预览

74LCXH162374GX

更新时间: 2024-01-16 06:27:46
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 触发器电阻器
页数 文件大小 规格书
11页 209K
描述
Low Voltage 16-Bit D-Type Flip-Flop with Bushold and 26з Series Resistors in Outputs

74LCXH162374GX 数据手册

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February 2001  
Revised October 2001  
74LCXH162374  
Low Voltage 16-Bit D-Type Flip-Flop with Bushold  
and 26Series Resistors in Outputs  
General Description  
Features  
5V tolerant control inputs and outputs  
The LCXH162374 contains sixteen non-inverting D-type  
flip-flops with 3-STATE outputs and is intended for bus ori-  
ented applications. The device is byte controlled. A buff-  
ered clock (CP) and Output Enable (OE) are common to  
each byte and can be shorted together for full 16-bit opera-  
tion.  
2.3V–3.6V VCC specifications provided  
7.0 ns tPD max (VCC = 3.3V), 20 µA ICC max  
Power down high impedance inputs and outputs  
±12 mA output drive (VCC = 3.0V)  
The LCXH162374 is designed for low voltage (2.5V or  
3.3V) VCC applications. The LCXH162374 data inputs  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
include active bushold circuitry, eliminating the need for  
external pull-up resistors to hold unused or floating data  
inputs at a valid logic level. The 26series resistor in the  
output helps reduce output overshoot and undershoot.  
Human body model > 2000V  
Machine model > 200V  
The LCXH162374 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
Equivalent 26series resistors on output  
Bushold on inputs eliminates the need for external  
pull-up/pull-down resistors  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LCXH162374GX  
(Note 1)  
BGA54A  
(Preliminary) [TAPE and REEL]  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
74LCXH162374MEA  
MS48A  
MS48A  
MTD48  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
[TUBES]  
74LCXH162374MEX  
(Note 2)  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
[TAPE and REEL]  
74LCXH162374MTD  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
[TUBES]  
74LCXH162374MTX  
(Note 2)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
[TAPE and REEL]  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Use this order number to receive devices in Tape and Reel.  
Logic Symbol  
GTO is a trademark of Fairchild Semiconductor Corporation.  
© 2001 Fairchild Semiconductor Corporation  
DS500446  
www.fairchildsemi.com  

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