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74LCXH162373MTDX PDF预览

74LCXH162373MTDX

更新时间: 2024-01-11 12:36:30
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其他 - ETC 锁存器逻辑集成电路光电二极管驱动
页数 文件大小 规格书
11页 222K
描述
8-Bit D-Type Latch

74LCXH162373MTDX 数据手册

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February 2001  
Revised August 2001  
74LCXH162373  
Low Voltage 16-Bit Transparent Latch  
with Bushold and 26Series Resistor Outputs  
General Description  
Features  
I 5V tolerant control inputs and outputs  
The LCXH162373 contains sixteen non-inverting latches  
with 3-STATE outputs and is intended for bus oriented  
applications. The device is byte controlled. The flip-flops  
appear transparent to the data when the Latch Enable (LE)  
is HIGH. When LE is LOW, the data that meets the setup  
time is latched. Data appears on the bus when the Output  
Enable (OE) is LOW. When OE is HIGH, the outputs are in  
a high impedance state.  
I 2.3V–3.6V VCC specifications provided  
I Equivalent 26series resistors on outputs  
I Bushold on inputs eliminates the need for external  
pull-up/pull-down resistors  
I 6.2 ns tPD max (VCC = 3.3V), 20 µA ICC max  
I Power down high impedance inputs and outputs  
The LCXH162373 is designed for low voltage (2.5V or  
3.3V) VCC applications with capability of interfacing to a 5V  
I
12 mA output drive (VCC = 3.0V)  
I Implements patented noise/EMI reduction circuitry  
I Latch-up performance exceeds 500 mA  
I ESD performance:  
signal environment. The 26series resistor helps reduce  
output overshoot and undershoot.  
The LCXH162373 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
Human body model > 2000V  
Machine model > 200V  
I Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
The LCXH162373 data inputs include active bushold cir-  
cuitry, eliminating the need for external pull-up resistors to  
hold unused or floating data inputs at a valid logic level.  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LCXH162373GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74LCXH162373MEA  
(Note 2)  
MS48A  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
74LCXH162373MTD  
(Note 2)  
MTD48  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2001 Fairchild Semiconductor Corporation  
DS500445  
www.fairchildsemi.com  

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