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74LCX574MTC-NL PDF预览

74LCX574MTC-NL

更新时间: 2024-11-18 04:00:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 触发器
页数 文件大小 规格书
14页 768K
描述
Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs

74LCX574MTC-NL 数据手册

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February 2006  
74LCX574  
Low Voltage Octal D-Type Flip-Flop  
with 5V Tolerant Inputs and Outputs  
Features  
General Description  
5V tolerant inputs and outputs  
The LCX574 is a high-speed, low power octal flip-flop  
with a buffered common Clock (CP) and a buffered  
common Output Enable (OE). The information presented  
to the D inputs is stored in the flip-flops on the LOW-to-  
HIGH Clock (CP) transition.  
2.3V–3.6V V specifications provided  
CC  
7.5ns t max (V = 3.3V), 10µA I max  
PD  
CC  
CC  
Power down high impedance inputs and outputs  
1
Supports live insertion/withdrawal  
The LCX574 is functionally identical to the LCX374  
except for the pinouts.  
±24mA output drive (V = 3.0V)  
CC  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds JEDEC 78 conditions  
ESD performance  
The LCX574 is designed for low voltage applications with  
capability of interfacing to a 5V signal environment. The  
LCX574 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
– Human body model > 2000V  
– Machine model > 200V  
Leadless Pb-Free DQFN package  
Ordering Information  
Package  
Order Number  
Number  
Package Description  
74LCX574WM  
M20B  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
3
74LCX574WM_NL  
M20B  
Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300"  
Wide  
74LCX574SJ  
M20D  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
2
74LCX574BQX  
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),  
JEDEC MO-241, 2.5 x 4.5mm  
74LCX574MSA  
74LCX574MTC  
MSA20 20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
3
74LCX574MTC_NL  
MTC20 Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,  
4.4mm Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Notes:  
1. To Ensure the high impedance state during power up or down, OE should be tied to V through a pull-up resistor: the minimum  
CC  
value of the resistor is determined by the current-sourcing capability of the driver.  
2. DQFN package available in Tape and Reel only  
3. “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
©2006 Fairchild Semiconductor Corporation  
74LCX574 Rev. 2.0.0  
1
www.fairchildsemi.com  

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