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74LCX574BQX PDF预览

74LCX574BQX

更新时间: 2024-11-24 22:15:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 触发器逻辑集成电路驱动
页数 文件大小 规格书
12页 557K
描述
Low Voltage Octal D-Type Flip-Flop with 5V Tolerant Inputs and Outputs

74LCX574BQX 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:MLP
包装说明:HVQCCN, LCC20,.1X.18,20针数:20
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.23
其他特性:BROADSIDE VERSION OF 374系列:LVC/LCX/Z
JESD-30 代码:R-XQCC-N20JESD-609代码:e4
长度:4.5 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大频率@ Nom-Sup:150000000 Hz
最大I(ol):0.024 A湿度敏感等级:1
位数:8功能数量:1
端口数量:2端子数量:20
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC20,.1X.18,20封装形状:RECTANGULAR
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:8.5 ns传播延迟(tpd):10.5 ns
认证状态:Not Qualified座面最大高度:0.8 mm
子类别:FF/Latches最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:POSITIVE EDGE宽度:2.5 mm
Base Number Matches:1

74LCX574BQX 数据手册

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March 1995  
Revised March 2005  
74LCX574  
Low Voltage Octal D-Type Flip-Flop  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX574 is a high-speed, low power octal flip-flop with  
a buffered common Clock (CP) and a buffered common  
Output Enable (OE). The information presented to the D  
inputs is stored in the flip-flops on the LOW-to-HIGH Clock  
(CP) transition.  
2.3V–3.6V VCC specifications provided  
7.5 ns tPD max (VCC 3.3V), 10 A ICC max  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
The LCX574 is functionally identical to the LCX374 except  
for the pinouts.  
24 mA output drive (VCC 3.0V)  
The LCX574 is designed for low voltage (2.5V or 3.3V) VCC  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds JEDEC 78 conditions  
ESD performance:  
applications with capability of interfacing to a 5V signal  
environment. The LCX574 is fabricated with an advanced  
CMOS technology to achieve high speed operation while  
maintaining CMOS low power dissipation.  
Human body model 2000V  
Machine model 200V  
Leadless Pb-Free DQFN package  
Note 1: To Ensure the high-Impedance state during power up or down, OE  
should be tied to V  
through a pull-up resistor: the minimum value or the  
CC  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LCX574WM  
M20B  
M20B  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
74LCX574WM_NL  
(Note 3)  
Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide  
74LCX574SJ  
M20D  
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LCX574BQX  
(Preliminary)  
(Note 2)  
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC  
MO-241, 2.5 x 4.5mm  
74LCX574MSA  
74LCX574MTC  
MSA20  
MTC20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74LCX574MTC_NL  
(Note 3)  
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Note 2: DQFN package available in Tape and Reel only  
Note 3: _NLindicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
© 2005 Fairchild Semiconductor Corporation  
DS012406  
www.fairchildsemi.com  

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