March 1995
Revised March 2005
74LCX540
Low Voltage Octal Buffer/Line Driver
with 5V Tolerant Inputs and Outputs
General Description
The LCX540 is an octal buffer/line driver designed to be
employed as a memory and address driver, clock driver
and bus oriented transmitter/receiver.
Features
■ 5V tolerant inputs and outputs
■ 2.3V–3.6V VCC specifications provided
■ 6.5 ns tPD max (VCC 3.3V), 10 A ICC max
This device is similar in function to the LCX240 while pro-
viding flow-through architecture (inputs on opposite side
from outputs). This pinout arrangement makes this device
especially useful as an output port for microprocessors,
allowing ease of layout and greater PC board density.
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds JEDEC 78 conditions
■ ESD performance:
The LCX540 is designed for low voltage (2.5V or 3.3V) VCC
applications with capability of interfacing to a 5V signal
environment. The LCX540 is fabricated with an advanced
CMOS technology to achieve high speed operation while
maintaining CMOS low power dissipation.
Human body model 2000V
Machine model 200V
■ Leadless Pb-Free DQFN package
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
through a pull-up resistor: the minimum value or the
CC
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Package
Order Number
Package Description
Number
74LCX540WM
74LCX540SJ
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX540BQX
(Preliminary)
(Note 2)
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX540MSA
74LCX540MTC
MSA20
MTC20
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX540MTC_NL
(Note 3)
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Pb-Free package per JEDEC J-STD-020B.
Note 2: DQFN package available in Tape and Reel only.
Note 3: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS012403
www.fairchildsemi.com