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74LCX32500 PDF预览

74LCX32500

更新时间: 2024-01-03 11:56:40
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 总线收发器
页数 文件大小 规格书
8页 87K
描述
Low Voltage 36-Bit Universal Bus Transceivers with 5V Tolerant Inputs and Outputs

74LCX32500 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA, BGA114,6X19,32
针数:114Reach Compliance Code:compliant
风险等级:5.92Is Samacsys:N
控制类型:INDEPENDENT CONTROL计数方向:BIDIRECTIONAL
系列:LVC/LCX/ZJESD-30 代码:R-PBGA-B114
JESD-609代码:e0长度:16 mm
逻辑集成电路类型:BUS TRANSCEIVER最大I(ol):0.024 A
湿度敏感等级:3位数:36
功能数量:1端口数量:2
端子数量:114最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA114,6X19,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
电源:3.3 VProp。Delay @ Nom-Sup:6 ns
传播延迟(tpd):8.4 ns认证状态:Not Qualified
座面最大高度:1.4 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED翻译:N/A
触发器类型:NEGATIVE EDGE宽度:5.5 mm
Base Number Matches:1

74LCX32500 数据手册

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April 2001  
Revised June 2002  
74LCX32500  
Low Voltage 36-Bit Universal Bus Transceivers  
with 5V Tolerant Inputs and Outputs  
General Description  
These 36-bit universal bus transceivers combine D-type  
latches and D-type flip-flops to allow data flow in transpar-  
ent, latched, and clocked modes.  
Features  
5V tolerant inputs and outputs  
2.3V–3.6V VCC specifications provided  
6.0 ns tPD max (VCC = 3.3V), 20 µA ICC max  
Data flow in each direction is controlled by output-enable  
(OEAB and OEBA), latch-enable (LEAB and LEBA), and  
clock (CLKAB and CLKBA) inputs.  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
±24 mA output drive (VCC = 3.0V)  
The LCX32500 is designed for low voltage (2.5V or 3.3V)  
VCC applications with the capability of interfacing to a 5V  
Uses patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
signal environment.  
The LCX32500 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power.  
Human body model > 2000V  
Machine model > 200V  
Packaged in plastic Fine-Pitch Ball Grid Array (FBGA)  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to VCC and OE tied to GND through a resistor: the minimum  
value or the resistor is determined by the current-sourcing capability of the  
driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX32500G  
(Note 2)(Note 3)  
BGA114A  
114-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
Note 2: Ordering code Gindicates Trays.  
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
© 2002 Fairchild Semiconductor Corporation  
DS500406  
www.fairchildsemi.com  

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