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74LCX32373GX PDF预览

74LCX32373GX

更新时间: 2024-11-10 22:36:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 总线驱动器总线收发器锁存器逻辑集成电路
页数 文件大小 规格书
8页 254K
描述
Low Voltage 32-Bit Transparent Latch with 5V Tolerant Inputs and Outputs Preliminary

74LCX32373GX 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:BGA包装说明:5.50 MM, PLASTIC, MO-205, FBGA-96
针数:96Reach Compliance Code:compliant
风险等级:5.45Is Samacsys:N
系列:LVC/LCX/ZJESD-30 代码:R-PBGA-B96
JESD-609代码:e0长度:13.5 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.024 A湿度敏感等级:3
位数:8功能数量:4
端口数量:2端子数量:96
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA96,6X16,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
Prop。Delay @ Nom-Sup:5.4 ns传播延迟(tpd):6.6 ns
认证状态:Not Qualified座面最大高度:1.4 mm
子类别:FF/Latches最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:5.5 mmBase Number Matches:1

74LCX32373GX 数据手册

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Preliminary  
January 2001  
Revised August 2001  
74LCX32373  
Low Voltage 32-Bit Transparent Latch  
with 5V Tolerant Inputs and Outputs (Preliminary)  
General Description  
Features  
I 5V tolerant inputs and outputs  
The LCX32373 contains thirty-two non-inverting latches  
with 3-STATE outputs and is intended for bus oriented  
applications. The device is byte controlled. The flip-flops  
appear transparent to the data when the Latch Enable (LE)  
is HIGH. When LE is LOW, the data that meets the setup  
time is latched. Data appears on the bus when the Output  
Enable (OE) is LOW. When OE is HIGH, the outputs are in  
a high impedance state.  
I 2.3V–3.6V VCC specifications provided  
I 5.4 ns tPD max (VCC = 3.3V), 20 µA ICC max  
I Power down high impedance inputs and outputs  
I Supports live insertion/withdrawal (Note 1)  
I
24 mA output drive (VCC = 3.0V)  
I Uses patented noise/EMI reduction circuitry  
I Latch-up performance exceeds 500 mA  
I ESD performance:  
The LCX32373 is designed for low voltage (2.5V or 3.3V)  
VCC applications with capability of interfacing to a 5V signal  
environment.  
Human body model > 2000V  
Machine model > 200V  
The LCX32373 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
I Packaged in plastic Fine-Pitch Ball Grid Array (FBGA)  
(Preliminary)  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to VCC through a pull-up resistor: the minimum value or the  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX32373GX  
(Note 2)  
BGA96A  
(Preliminary)  
96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
Note 2: BGA package available in Tape and Reel only.  
Logic Symbol  
© 2001 Fairchild Semiconductor Corporation  
DS500547  
www.fairchildsemi.com  

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