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74LCX32245GX PDF预览

74LCX32245GX

更新时间: 2024-02-23 03:45:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
8页 128K
描述
Bus Transceiver, LVC/LCX/Z Series, 2-Func, 16-Bit, True Output, CMOS, PBGA96, 5.50 MM, PLASTIC, MO-205, FBGA-96

74LCX32245GX 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:LFBGA,针数:96
Reach Compliance Code:unknown风险等级:5.74
系列:LVC/LCX/ZJESD-30 代码:R-PBGA-B96
JESD-609代码:e1长度:13.5 mm
逻辑集成电路类型:BUS TRANSCEIVER位数:16
功能数量:2端口数量:2
端子数量:96最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE WITH SERIES RESISTOR
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH传播延迟(tpd):5.4 ns
认证状态:Not Qualified座面最大高度:1.4 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
宽度:5.5 mmBase Number Matches:1

74LCX32245GX 数据手册

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November 2001  
Revised June 2002  
74LCX32245  
Low Voltage 32-Bit Bidirectional Transceiver  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX32245 contains thirty-two non-inverting bidirec-  
tional buffers with 3-STATE outputs and is intended for bus  
oriented applications. The device is designed for low volt-  
age (2.5V or 3.3V) VCC applications with capability of inter-  
2.3V–3.6V VCC specifications provided  
4.5 ns tPD max (VCC = 3.3V), 20 µA ICC max  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
±24 mA output drive (VCC = 3.0V)  
facing to a 5V signal environment. The device is byte  
controlled. Each byte has separate control inputs which  
could be shorted together for full 32-bit operation. The T/R  
inputs determine the direction of data flow through the  
device. The OE inputs disable both the A and B ports by  
placing them in a high impedance state.  
Uses patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LCX32245 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Human body model > 2000V  
Machine model > 200V  
Packaged in plastic Fine-Pitch Ball Grid Array (FBGA)  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to VCC through a pull-up resistor: the minimum value or the  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX32245G  
(Note 2)(Note 3)  
BGA96A  
96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
Note 2: Ordering code Gindicates Trays.  
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2002 Fairchild Semiconductor Corporation  
DS500428  
www.fairchildsemi.com  

74LCX32245GX 替代型号

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