February 1994
Revised March 2005
74LCX245
Low Voltage Bidirectional Transceiver
with 5V Tolerant Inputs and Outputs
General Description
Features
■ 5V tolerant inputs and outputs
The LCX245 contains eight non-inverting bidirectional buff-
ers with 3-STATE outputs and is intended for bus oriented
applications. The device is designed for low voltage (2.5V
and 3.3V) VCC applications with capability of interfacing to
■ 2.3V to 3.6V VCC specifications provided
■ 7.0 ns tPD max (VCC 3.3V), 10 A ICC max
■ Power down high impedance inputs and outputs
■ Supports live insertion/withdrawal (Note 1)
a 5V signal environment. The T/R input determines the
direction of data flow through the device. The OE input dis-
ables both the A and B ports by placing them in a high
impedance state.
■
24 mA output drive (VCC 3.0V)
■ Implements patented noise/EMI reduction circuitry
■ Latch-up performance exceeds 500 mA
■ ESD performance:
The LCX245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power dissipation.
Human body model 2000V
Machine model 200V
■ Leadless DQFN Pb-Free package
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to V
through a pull-up resistor: the minimum value or the
CC
resistor is determined by the current-sourcing capability of the driver.
Ordering Code:
Package
Order Number
Package Description
Number
74LCX245WM
(Note 2)
M20B
M20B
M20D
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
Pb-Free 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX245WMX_NL
(Note 4)
74LCX245SJ
(Note 2)
74LCX245BQX
(Note 3)
MLP020B Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX245MSA
(Note 2)
MSA20
MTC20
MTC20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX245MTC
(Note 2)
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LCX245MTCX_NL
(Note 4)
Pb-Free 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Pb-Free package per JEDEC J-STD-020B.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 3: DQFN package available in Tape and Reel only.
Note 4: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.
© 2005 Fairchild Semiconductor Corporation
DS012006
www.fairchildsemi.com