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74LCX2244SJ PDF预览

74LCX2244SJ

更新时间: 2024-09-24 22:35:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器
页数 文件大小 规格书
9页 105K
描述
Low Voltage Buffer/Line Driver with 5V Tolerant Inputs and Outputs with 26W Series Resistors in the Outputs

74LCX2244SJ 数据手册

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October 1995  
Revised June 1999  
74LCX2244  
Low Voltage Buffer/Line Driver with 5V Tolerant Inputs  
and Outputs with 26Series Resistors in the Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX2244 contains eight non-inverting buffers with 3-  
STATE outputs. The device may be employed as a mem-  
ory address driver, clock driver and bus-oriented transmit-  
ter/receiver. The LCX2244 is designed for low voltage  
(2.5V or 3.3V) VCC applications with capability of interfac-  
2.3V–3.6V VCC specifications provided  
7.5 ns tPD max (VCC = 3.3V) 10 µA ICC max  
Power down high impedance inputs and outputs  
26-series resistors in the outputs  
ing to a 5V signal environment. The 26-series resistors  
help reduce output overshoot and undershoot.  
Supports live insertion/withdrawal (Note 1)  
±12 mA output drive (VCC = 3.0V)  
The LCX2244 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
Human body model > 2000V  
Machine model > 200V  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to V  
through a pull-up resistor: the minimum value or the  
CC  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX2244WM  
74LCX2244SJ  
M20B  
M20D  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LCX2244MSA  
74LCX2244MTC  
MSA20  
MTC20  
20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.  
Logic Symbol  
Connection Diagram  
IEEE/IEC  
© 1999 Fairchild Semiconductor Corporation  
DS012569  
www.fairchildsemi.com  

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