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74LCX16373MTDX_NL PDF预览

74LCX16373MTDX_NL

更新时间: 2024-11-04 13:04:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 锁存器
页数 文件大小 规格书
10页 130K
描述
Bus Driver, LVC/LCX/Z Series, 2-Func, 8-Bit, True Output, CMOS, PDSO48, 6.10 MM, MO-153ED, TSSOP-48

74LCX16373MTDX_NL 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:6.10 MM, MO-153ED, TSSOP-48
针数:48Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.11
Is Samacsys:N系列:LVC/LCX/Z
JESD-30 代码:R-PDSO-G48JESD-609代码:e3
长度:12.5 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大I(ol):0.024 A
湿度敏感等级:2位数:8
功能数量:2端口数量:2
端子数量:48最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP48,.3,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
电源:3.3 VProp。Delay @ Nom-Sup:5.4 ns
传播延迟(tpd):6.6 ns认证状态:Not Qualified
座面最大高度:1.2 mm子类别:FF/Latches
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:6.1 mm
Base Number Matches:1

74LCX16373MTDX_NL 数据手册

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February 1994  
Revised May 2005  
74LCX16373  
Low Voltage 16-Bit Transparent Latch  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX16373 contains sixteen non-inverting latches with  
3-STATE outputs and is intended for bus oriented applica-  
tions. The device is byte controlled. The flip-flops appear  
transparent to the data when the Latch Enable (LE) is  
HIGH. When LE is LOW, the data that meets the setup time  
is latched. Data appears on the bus when the Output  
Enable (OE) is LOW. When OE is HIGH, the outputs are in  
a high impedance state.  
2.3V–3.6V VCC specifications provided  
5.4 ns tPD max (VCC 3.3V), 20 A ICC max  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
24 mA output drive (VCC 3.0V)  
Uses patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LCX16373 is designed for low voltage (2.5V or 3.3V)  
VCC applications with capability of interfacing to a 5V signal  
environment.  
Human body model 2000V  
The LCX16373 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Machine model 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA)  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to V  
through a pull-up resistor: the minimum value or the  
CC  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX16373G  
(Note 2)(Note 3)  
BGA54A  
MS48A  
MTD48  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
74LCX16373MEA  
(Note 3)  
74LCX16373MTD  
(Note 3)  
Note 2: Ordering code Gindicates Trays.  
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2005 Fairchild Semiconductor Corporation  
DS012002  
www.fairchildsemi.com  

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