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74LCX16245 PDF预览

74LCX16245

更新时间: 2024-11-03 22:45:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 123K
描述
Low Voltage 16-Bit Bidirectional Transceiver with 5V Tolerant Inputs and Outputs

74LCX16245 数据手册

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February 1994  
Revised May 2005  
74LCX16245  
Low Voltage 16-Bit Bidirectional Transceiver  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX16245 contains sixteen non-inverting bidirectional  
buffers with 3-STATE outputs and is intended for bus ori-  
ented applications. The device is designed for low voltage  
(2.5V or 3.3V) VCC applications with capability of interfac-  
2.3V–3.6V VCC specifications provided  
4.5 ns tPD max (VCC 3.3V), 20 A ICC max  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
ing to a 5V signal environment. The device is byte con-  
trolled. Each byte has separate control inputs which could  
be shorted together for full 16-bit operation. The T/R inputs  
determine the direction of data flow through the device.  
The OE inputs disable both the A and B ports by placing  
them in a high impedance state.  
24 mA output drive (VCC 3.0V)  
Uses patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LCX16245 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Human body model 2000V  
Machine model 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA)  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to V  
through a pull-up resistor: the minimum value or the  
CC  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX16245G  
(Note 2)(Note 3)  
BGA54A  
MS48A  
MTD48  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
74LCX16245MEA  
(Note 3)  
74LCX16245MTD  
(Note 3)  
Note 2: Ordering code Gindicates Trays.  
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2005 Fairchild Semiconductor Corporation  
DS012001  
www.fairchildsemi.com  

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