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74LCX162244MEAX_NL PDF预览

74LCX162244MEAX_NL

更新时间: 2024-11-24 13:04:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 驱动器
页数 文件大小 规格书
10页 113K
描述
Bus Driver, LVC/LCX/Z Series, 4-Func, 4-Bit, True Output, CMOS, PDSO48, 0.300 INCH, MO-118, SSOP-48

74LCX162244MEAX_NL 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:SSOP包装说明:0.300 INCH, MO-118, SSOP-48
针数:48Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.11
Is Samacsys:N控制类型:ENABLE LOW
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G48
JESD-609代码:e3长度:15.875 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.012 A湿度敏感等级:1
位数:4功能数量:4
端口数量:2端子数量:48
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE WITH SERIES RESISTOR输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装等效代码:SSOP48,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:5.3 ns传播延迟(tpd):6.4 ns
认证状态:Not Qualified座面最大高度:2.74 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.495 mmBase Number Matches:1

74LCX162244MEAX_NL 数据手册

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September 2000  
Revised August 2001  
74LCX162244  
Low Voltage 16-Bit Buffer/Line Driver  
with 26Series Resistors in Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX162244 contains sixteen non-inverting buffers with  
3-STATE outputs designed to be employed as a memory  
and address driver, clock driver, or bus oriented transmit-  
ter/receiver. The device is nibble controlled. Each nibble  
has separate 3-STATE control inputs which can be shorted  
together for full 16-bit operation.  
2.3V–3.6V VCC specifications provided  
Outputs include equivalent series resistance of 26to  
make external termination resistors unnecessary and  
reduce overshoot and undershoot  
5.3 ns tPD max (VCC = 3.0V), 20 µA ICC max  
The LCX162244 is designed for low voltage (2.5V or 3.3V)  
V
CC applications with capability of interfacing to a 5V signal  
Power down high impedance inputs and outputs  
±12 mA output drive (VCC = 3.0V)  
environment.  
In addition, the outputs include equivalent 26(nominal)  
series resistors to reduce overshoot and undershoot and  
are designed to sink/source up to 12 mA at VCC = 3.0V.  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LCX162244 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
Human body model > 2000V  
Machine model > 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74LCX162244GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74LCX162244MEA  
(Note 2)  
MS48A  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
74LCX162244MTD  
(Note 2)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2001 Fairchild Semiconductor Corporation  
DS500471  
www.fairchildsemi.com  

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