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74LCX162244GX PDF预览

74LCX162244GX

更新时间: 2024-11-23 22:16:03
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 总线驱动器总线收发器逻辑集成电路
页数 文件大小 规格书
10页 113K
描述
Low Voltage 16-Bit Buffer/Line Driver with 26з Series Resistors in Outputs

74LCX162244GX 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA, BGA54,6X9,32
针数:54Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.71
控制类型:ENABLE LOW系列:LVC/LCX/Z
JESD-30 代码:R-PBGA-B54JESD-609代码:e0
长度:8 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大I(ol):0.012 A
湿度敏感等级:3位数:4
功能数量:4端口数量:2
端子数量:54最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE WITH SERIES RESISTOR
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装等效代码:BGA54,6X9,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
包装方法:TAPE AND REEL峰值回流温度(摄氏度):260
电源:3.3 VProp。Delay @ Nom-Sup:5.3 ns
传播延迟(tpd):6.4 ns认证状态:Not Qualified
座面最大高度:1.4 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:5.5 mm
Base Number Matches:1

74LCX162244GX 数据手册

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September 2000  
Revised August 2001  
74LCX162244  
Low Voltage 16-Bit Buffer/Line Driver  
with 26Series Resistors in Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX162244 contains sixteen non-inverting buffers with  
3-STATE outputs designed to be employed as a memory  
and address driver, clock driver, or bus oriented transmit-  
ter/receiver. The device is nibble controlled. Each nibble  
has separate 3-STATE control inputs which can be shorted  
together for full 16-bit operation.  
2.3V–3.6V VCC specifications provided  
Outputs include equivalent series resistance of 26to  
make external termination resistors unnecessary and  
reduce overshoot and undershoot  
5.3 ns tPD max (VCC = 3.0V), 20 µA ICC max  
The LCX162244 is designed for low voltage (2.5V or 3.3V)  
V
CC applications with capability of interfacing to a 5V signal  
Power down high impedance inputs and outputs  
±12 mA output drive (VCC = 3.0V)  
environment.  
In addition, the outputs include equivalent 26(nominal)  
series resistors to reduce overshoot and undershoot and  
are designed to sink/source up to 12 mA at VCC = 3.0V.  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
The LCX162244 is fabricated with an advanced CMOS  
technology to achieve high speed operation while maintain-  
ing CMOS low power dissipation.  
Human body model > 2000V  
Machine model > 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA) (Preliminary)  
Ordering Code:  
Order Number  
Package Number  
Package Description  
74LCX162244GX  
(Note 1)  
BGA54A  
(Preliminary)  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
[TAPE and REEL]  
74LCX162244MEA  
(Note 2)  
MS48A  
MTD48  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
74LCX162244MTD  
(Note 2)  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
Note 1: BGA package available in Tape and Reel only.  
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2001 Fairchild Semiconductor Corporation  
DS500471  
www.fairchildsemi.com  

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