是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | MLP |
包装说明: | HVQCCN, LCC14,.1X.12,20 | 针数: | 14 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.09 |
Samacsys Confidence: | 4 | Samacsys Status: | Released |
Samacsys PartID: | 1012373 | Samacsys Pin Count: | 15 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Other |
Samacsys Footprint Name: | QFN14 3.0x2.5, 0.5P CASE 510CB ISSUE O_1 | Samacsys Released Date: | 2019-07-30 17:10:49 |
Is Samacsys: | N | 控制类型: | ENABLE LOW |
系列: | LVC/LCX/Z | JESD-30 代码: | R-XQCC-N14 |
JESD-609代码: | e4 | 长度: | 3 mm |
逻辑集成电路类型: | BUS DRIVER | 最大I(ol): | 0.024 A |
湿度敏感等级: | 1 | 位数: | 1 |
功能数量: | 4 | 端口数量: | 2 |
端子数量: | 14 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 输出特性: | 3-STATE |
输出极性: | TRUE | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装等效代码: | LCC14,.1X.12,20 |
封装形状: | RECTANGULAR | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
包装方法: | TAPE AND REEL | 峰值回流温度(摄氏度): | 260 |
电源: | 3.3 V | Prop。Delay @ Nom-Sup: | 6 ns |
传播延迟(tpd): | 7.2 ns | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 子类别: | Bus Driver/Transceivers |
最大供电电压 (Vsup): | 3.6 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2.5 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
SN74LV125ATRGYRG4 | TI |
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