是否无铅: | 不含铅 | 生命周期: | Active |
包装说明: | TSSOP, TSSOP14,.25 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 1 week | 风险等级: | 0.85 |
系列: | LVC/LCX/Z | JESD-30 代码: | R-PDSO-G14 |
JESD-609代码: | e4 | 长度: | 5 mm |
负载电容(CL): | 50 pF | 逻辑集成电路类型: | BUFFER |
最大I(ol): | 0.024 A | 湿度敏感等级: | 1 |
功能数量: | 6 | 输入次数: | 1 |
端子数量: | 14 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 输出特性: | OPEN-DRAIN |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP14,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 包装方法: | TR |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3.3 V |
Prop。Delay @ Nom-Sup: | 3.7 ns | 传播延迟(tpd): | 4.4 ns |
认证状态: | Not Qualified | 施密特触发器: | NO |
座面最大高度: | 1.2 mm | 子类别: | Gates |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 4.4 mm |
Base Number Matches: | 1 |
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74LCX07MTC | ONSEMI |
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MC74LCX07DTG | ONSEMI |
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