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74LCX07 PDF预览

74LCX07

更新时间: 2024-11-04 22:45:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 512K
描述
Low Voltage Hex Buffer with Open Drain Outputs

74LCX07 数据手册

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October 1999  
Revised February 2005  
74LCX07  
Low Voltage Hex Buffer with Open Drain Outputs  
General Description  
The LCX07 contains six buffers. The inputs tolerate volt-  
ages up to 7V allowing the interface of 5V systems to 3V  
systems.  
Features  
5V tolerant inputs  
2.3V to 5.5V VCC specifications provided  
2.9 ns tPD max (VCC 3.3V), 10 A ICC max  
Power down high impedance inputs and outputs  
The outputs of the LCX07 are open drain and can be con-  
nected to other open drain outputs to implement active  
HIGH wire AND or active LOW wire OR functions.  
24 mA output drive (VCC 3.0V)  
The 74LCX07 is fabricated with advanced CMOS technol-  
ogy to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Implements patented noise/EMI reduction circuitry  
Latch-up performance exceeds JEDEC 78 conditions  
ESD performance:  
Human body model 2000V  
Machine model 200V  
Leadless Pb-Free DQFN package  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
74LCX07M  
M14A  
M14A  
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
74LCX07MX_NL  
(Note 1)  
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
74LCX07SJ  
M14D  
Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
74LCX07BQX  
(Note 2)  
MLP014A Pb-Free 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC  
MO-241, 2.5 x 3.0mm  
74LCX07MTC  
MTC14  
MTC14  
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
74LCX07MTCX_NL  
(Note 1)  
Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Note 1: “_NL” indicates Pb-Free package (per JEDEC J-STD-020B). Device available in Tape and Reel only.  
Note 2: DQFN package available in Tape and Reel only.  
© 2005 Fairchild Semiconductor Corporation  
DS500238  
www.fairchildsemi.com  

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