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74HC74DG PDF预览

74HC74DG

更新时间: 2024-11-11 04:28:55
品牌 Logo 应用领域
安森美 - ONSEMI 触发器锁存器逻辑集成电路光电二极管
页数 文件大小 规格书
8页 133K
描述
Dual D Flip−Flop with Set and Reset High−Performance Silicon−Gate CMOS

74HC74DG 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP, SOP14,.25针数:14
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.02系列:HC/UH
JESD-30 代码:R-PDSO-G14JESD-609代码:e3
长度:8.65 mm负载电容(CL):50 pF
逻辑集成电路类型:D FLIP-FLOP最大频率@ Nom-Sup:20000000 Hz
最大I(ol):0.004 A位数:1
功能数量:2端子数量:14
最高工作温度:125 °C最低工作温度:-55 °C
输出极性:COMPLEMENTARY封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP14,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
包装方法:RAIL峰值回流温度(摄氏度):260
电源:2/6 V传播延迟(tpd):150 ns
认证状态:Not Qualified座面最大高度:1.75 mm
子类别:FF/Latches最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:MATTE TIN
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
触发器类型:POSITIVE EDGE宽度:3.9 mm
Base Number Matches:1

74HC74DG 数据手册

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74HC74  
Dual D Flip−Flop with Set  
and Reset  
HighPerformance SiliconGate CMOS  
The 74HC74 is identical in pinout to the LS74. The device inputs are  
compatible with standard CMOS outputs; with pullup resistors, they  
are compatible with LSTTL outputs.  
This device consists of two D flipflops with individual Set, Reset,  
and Clock inputs. Information at a Dinput is transferred to the  
corresponding Q output on the next positive going edge of the clock  
input. Both Q and Q outputs are available from each flipflop. The Set  
and Reset inputs are asynchronous.  
http://onsemi.com  
MARKING  
DIAGRAMS  
14  
SOIC14  
D SUFFIX  
CASE 751A  
HC74G  
AWLYWW  
14  
14  
Features  
1
Output Drive Capability: 10 LSTTL Loads  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2.0 to 6.0 V  
1
14  
Low Input Current: 1.0 mA  
HC  
74  
TSSOP14  
DT SUFFIX  
CASE 948G  
High Noise Immunity Characteristic of CMOS Devices  
In Compliance with the JEDEC Standard No. 7A Requirements  
ESD Performance: HBM > 2000 V; Machine Model > 200 V  
Chip Complexity: 128 FETs or 32 Equivalent Gates  
PbFree Packages are Available  
ALYW G  
1
G
1
HC74  
A
L, WL  
Y
= Device Code  
= Assembly Location  
= Wafer Lot  
= Year  
W, WW = Work Week  
G or G  
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
©
Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
February, 2007 Rev. 0  
74HC74/D  

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