是否Rohs认证: | 符合 | 生命周期: | Transferred |
包装说明: | DHVQFN-16 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.23 |
Is Samacsys: | N | 模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码: | R-PQCC-N16 | JESD-609代码: | e4 |
长度: | 3.5 mm | 湿度敏感等级: | 1 |
信道数量: | 8 | 功能数量: | 1 |
端子数量: | 16 | 通态电阻匹配规范: | 4 Ω |
最大通态电阻 (Ron): | 650 Ω | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装形状: | RECTANGULAR |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
座面最大高度: | 1 mm | 最大供电电压 (Vsup): | 6 V |
最小供电电压 (Vsup): | 2 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 最长断开时间: | 115 ns |
最长接通时间: | 115 ns | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | NICKEL PALLADIUM GOLD |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 2.5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
74HC4851BQ,115 | NXP |
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