Source Url Status Check Date: | 2013-06-14 00:00:00 | 是否无铅: | 含铅 |
是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | QFN | 包装说明: | HVQCCN, LCC24/28,.14X.2,20 |
针数: | 24 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.19 |
Is Samacsys: | N | 模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码: | R-PQCC-N24 | JESD-609代码: | e4 |
长度: | 5.5 mm | 湿度敏感等级: | 1 |
信道数量: | 16 | 功能数量: | 1 |
端子数量: | 24 | 标称断态隔离度: | 50 dB |
通态电阻匹配规范: | 9 Ω | 最大通态电阻 (Ron): | 180 Ω |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVQCCN |
封装等效代码: | LCC24/28,.14X.2,20 | 封装形状: | RECTANGULAR |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
电源: | 2/9 V | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 子类别: | Multiplexer or Switches |
最大供电电流 (Isup): | 50 mA | 最大供电电压 (Vsup): | 10 V |
最小供电电压 (Vsup): | 2 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 最长断开时间: | 435 ns |
最长接通时间: | 450 ns | 切换: | BREAK-BEFORE-MAKE |
技术: | CMOS | 温度等级: | AUTOMOTIVE |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 3.5 mm |
Base Number Matches: | 1 |
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