是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | SSOP |
包装说明: | SSOP, SOP16,.25 | 针数: | 16 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.19 | 模拟集成电路 - 其他类型: | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码: | R-PDSO-G16 | JESD-609代码: | e4 |
长度: | 6.2 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 3 |
端子数量: | 16 | 标称断态隔离度: | 50 dB |
通态电阻匹配规范: | 8 Ω | 最大通态电阻 (Ron): | 160 Ω |
最高工作温度: | 125 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SSOP |
封装等效代码: | SOP16,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2/6,GND/-6 V | 认证状态: | Not Qualified |
座面最大高度: | 2 mm | 最大信号电流: | 0.025 A |
子类别: | Multiplexer or Switches | 最大供电电流 (Isup): | 0.16 mA |
最大供电电压 (Vsup): | 10 V | 最小供电电压 (Vsup): | 2 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
最长断开时间: | 36 ns | 最长接通时间: | 37 ns |
切换: | BREAK-BEFORE-MAKE | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | NICKEL PALLADIUM GOLD |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 5.3 mm | Base Number Matches: | 1 |
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