SN74AVCH1T45
SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVER
WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS
www.ti.com
SCES598D–JULY 2004–REVISED JANUARY 2008
1
FEATURES
2
•
Available in the Texas Instruments NanoStar™
DBV OR DCK PACKAGE
(TOP VIEW)
and NanoFree™ Packages
•
•
Control Inputs VIH/VIL Levels Are Referenced to
VCCA Voltage
1
2
3
6
5
4
VCCA
GND
A
VCCB
DIR
B
Fully Configurable Dual-Rail Design Allows
Each Port to Operate Over the Full 1.2-V to
3.6-V Power-Supply Range
•
•
I/Os Are 4.6-V Tolerant
YEP OR YZP PACKAGE
(BOTTOM VIEW)
Ioff Supports Partial-Power-Down Mode
Operation
3
2
1
4
5
6
A
GND
VCCA
B
DIR
VCCB
•
•
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Typical Max Data Rates
–
–
–
–
–
380 Mbps (1.8-V to 3.3-V Translation)
200 Mbps (<1.8-V to 3.3-V Translation)
200 Mbps (Translate to 2.5 V or 1.8 V)
150 Mbps (Translate to 1.5 V)
100 Mbps (Translate to 1.2 V)
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This single-bit noninverting bus transceiver uses two separate configurable power-supply rails. The A port is
designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track
VCCB. VCCB accepts any supply voltage from 1.2 V to 3.6 V. This allows for universal low-voltage bidirectional
translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, and 3.3-V voltage nodes.
The SN74AVCH1T45 is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input.
The SN74AVCH1T45 is designed so that the DIR input is powered by VCCA
.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Tape and reel
SN74AVCH1T45YZPR
_ _ _TF_
–40°C to 85°C
Tape and reel
Tape and reel
SN74AVCH1T45DBVR
SN74AVCH1T45DCKR
ET1_
TF_
SOT (SC-70) – DCK
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2004–2008, Texas Instruments Incorporated