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74AUP1G240DCKTE4 PDF预览

74AUP1G240DCKTE4

更新时间: 2024-11-05 08:03:11
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路光电二极管输出元件
页数 文件大小 规格书
21页 838K
描述
LOW-POWER SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT

74AUP1G240DCKTE4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:TSSOP, TSSOP5/6,.08针数:5
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.28控制类型:ENABLE LOW
系列:AUP/ULP/VJESD-30 代码:R-PDSO-G5
JESD-609代码:e4长度:2 mm
负载电容(CL):30 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.0017 A湿度敏感等级:1
位数:1功能数量:1
端口数量:2端子数量:5
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:INVERTED
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP5/6,.08封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:1.2/3.3 V
Prop。Delay @ Nom-Sup:25.7 ns传播延迟(tpd):25.7 ns
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):0.8 V标称供电电压 (Vsup):1.2 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.25 mmBase Number Matches:1

74AUP1G240DCKTE4 数据手册

 浏览型号74AUP1G240DCKTE4的Datasheet PDF文件第2页浏览型号74AUP1G240DCKTE4的Datasheet PDF文件第3页浏览型号74AUP1G240DCKTE4的Datasheet PDF文件第4页浏览型号74AUP1G240DCKTE4的Datasheet PDF文件第5页浏览型号74AUP1G240DCKTE4的Datasheet PDF文件第6页浏览型号74AUP1G240DCKTE4的Datasheet PDF文件第7页 
SN74AUP1G240  
www.ti.com  
SCES627C MARCH 2005REVISED MAY 2010  
LOW-POWER SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT  
Check for Samples: SN74AUP1G240  
1
FEATURES  
Available in the Texas Instruments NanoStar™  
Input Hysteresis Allows Slow Input Transition  
Package  
and Better Switching Noise Immunity at the  
Input  
Low Static-Power Consumption  
Wide Operating VCC Range of 0.8 V to 3.6 V  
Optimized for 3.3-V Operation  
ICC = 0.9 mA Max  
Low Dynamic-Power Consumption  
Cpd = 4.2 pF at 3.3 V Typ  
Low Input Capacitance  
CI = 1.5 pF Typ  
3.6-V I/O Tolerant to Support Mixed-Mode  
Signal Operation  
tpd = 4.7 ns Max at 3.3 V  
Suitable for Point-to-Point Applications  
Low Noise – Overshoot and Undershoot  
<10% of VCC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Input-Disable Feature Allows Floating Input  
Conditions  
ESD Performance Tested Per JESD 22  
2000-V Human-Body Model  
(A114-B, Class II)  
Ioff Supports Partial Power-Down-Mode  
Operation  
1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
VCC  
1
2
3
5
4
OE  
A
VCC  
1
2
3
5
OE  
A
GND  
Y
4
GND  
Y
DRY PACKAGE  
(TOP VIEW)  
DSF PACKAGE  
(TOP VIEW)  
YFP PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(TOP VIEW)  
A2  
A2  
A1  
1
2
6
5
4
A1  
1
2
5
OE  
A
VCC  
N.C.  
Y
OE  
A
VCC  
1
2
3
6
5
4
1
2
3
6
5
4
OE  
A
VCC  
NC  
Y
V
CC  
OE  
A
B1  
B2  
C2  
B1  
N.C.  
C1 3  
C1 3  
4
C2  
Y
GND  
GND  
GND  
GND  
Y
See mechanical drawings for dimensions.  
N.C. – No internal connection  
DESCRIPTION/ORDERING INFORMATION  
The AUP family is TI's premier solution to the industry's low power needs in battery-powered portable  
applications. This family ensures a very low static and dynamic power consumption across the entire VCC range  
of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see  
Figure 1 and Figure 2).  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2005–2010, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
 

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