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74AUC2G241DCURG4 PDF预览

74AUC2G241DCURG4

更新时间： 2024-01-18 07:38:23
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路光电二极管输出元件
页数 文件大小 规格书
15页 526K
描述
DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

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74AUC2G241DCURG4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：SOIC
包装说明：GREEN, PLASTIC, VSSOP-8针数：8
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.73Is Samacsys：N
其他特性：ONE ACTIVE HIGH OUTPUT ENABLE控制类型：ENABLE LOW/HIGH
系列：AUCJESD-30 代码：R-PDSO-G8
JESD-609代码：e4长度：2.3 mm
负载电容（CL）：15 pF逻辑集成电路类型：BUS DRIVER
最大I（ol）：0.005 A湿度敏感等级：1
位数：1功能数量：2
端口数量：2端子数量：8
最高工作温度：85 °C最低工作温度：-40 °C
输出特性：3-STATE输出极性：TRUE
封装主体材料：PLASTIC/EPOXY封装代码：VSSOP
封装等效代码：TSSOP8,.12,20封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：260电源：1.2/2.5 V
Prop。Delay @ Nom-Sup：3.5 ns传播延迟（tpd）：3.5 ns
认证状态：Not Qualified座面最大高度：0.9 mm
子类别：Bus Driver/Transceivers最大供电电压 (Vsup)：2.7 V
最小供电电压 (Vsup)：0.8 V标称供电电压 (Vsup)：1.2 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.5 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：2 mmBase Number Matches：1

74AUC2G241DCURG4 数据手册

 浏览型号74AUC2G241DCURG4的Datasheet PDF文件第2页浏览型号74AUC2G241DCURG4的Datasheet PDF文件第3页浏览型号74AUC2G241DCURG4的Datasheet PDF文件第4页浏览型号74AUC2G241DCURG4的Datasheet PDF文件第5页浏览型号74AUC2G241DCURG4的Datasheet PDF文件第6页浏览型号74AUC2G241DCURG4的Datasheet PDF文件第7页 
SN74AUC2G241  
DUAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCES535C–DECEMBER 2003–REVISED JANUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
Low Power Consumption, 10 µA at 1.8 V  
±8-mA Output Drive at 1.8 V  
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
•
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 1.9 ns at 1.8 V  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
GND  
2Y  
2A  
1Y  
VCC  
2OE  
1Y  
1
2
3
4
8
7
6
5
1OE  
1A  
VCC  
2OE  
1Y  
1
2
3
4
8
7
6
5
1OE  
1A  
3 6  
2 7  
1 8  
1A  
2OE  
VCC  
2Y  
1OE  
GND  
2A  
2Y  
GND  
2A  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC  
operation.  
The SN74AUC2G241 is designed specifically to improve the performance and density of 3-state memory  
address drivers, clock drivers, and bus-oriented receivers and transmitters.  
The device is organized as two 1-bit line drivers with separate output-enable (1OE, 2OE) inputs. When 1OE is  
low or 2OE is high, the device passes data from the A inputs to the Y outputs. When 1OE is high or 2OE is low,  
the outputs are in the high-impedance state.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74AUC2G241YZPR  
_ _ _U2_  
–40°C to 85°C  
Reel of 3000  
Reel of 3000  
SN74AUC2G241DCTR  
SN74AUC2G241DCUR  
U41_ _ _  
U2_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...15

中文翻译

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74AUC2G241DCURG4 替代型号

型号 品牌 替代类型 描述 数据表
74AUC2G241DCTRE4 TI

完全替代

 DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SN74AUC2G241DCTR TI

完全替代

 DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
74AUC2G241DCURE4 TI

完全替代

 DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

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