Datasheet > 74AHCT30BQ,115

74AHCT30BQ,115

更新时间： 2024-09-18 14:37:23

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
14页	78K
描述
74AHC(T)30 - 8-input NAND gate QFN 14-Pin

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中文翻译

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技术参数
数据手册

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74AHCT30BQ,115 技术参数

是否Rohs认证：	符合	生命周期：	Transferred
零件包装代码：	QFN	包装说明：	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
针数：	14	Reach Compliance Code：	compliant
风险等级：	8.01	Base Number Matches：	1

74AHCT30BQ,115 数据手册

74AHC30; 74AHCT30

8-input NAND gate

Rev. 03 — 26 June 2009

Product data sheet

1. General description

The 74AHC30; 74AHCT30 is a high-speed Si-gate CMOS device and is pin compatible

with Low-power Schottky TTL (LSTTL). It is speciﬁed in compliance with JEDEC standard

No. 7-A.

The 74AHC30; 74AHCT30 provides an 8-input NAND function.

2. Features

I Balanced propagation delays

I All inputs have Schmitt-trigger actions

I Inputs accept voltages higher than V_CC

I Input levels:

N For 74AHC30: CMOS level

N For 74AHCT30: TTL level

I ESD protection:

N HBM JESD22-A114E exceeds 2000 V

N MM JESD22-A115-A exceeds 200 V

N CDM JESD22-C101C exceeds 1000 V

I Multiple package options

I Speciﬁed from −40 °C to +85 °C and from −40 °C to +125 °C

3. Ordering information

Table 1.

Ordering information

Type number

Package

Temperature range Name

Description

Version

74AHC30D

−40 °C to +125 °C

SO14

plastic small outline package; 14 leads;

body width 3.9 mm

SOT108-1

74AHCT30D

74AHC30PW

74AHCT30PW

74AHC30BQ

74AHCT30BQ

TSSOP14

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

SOT402-1

DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1

thin quad ﬂat package; no leads; 14 terminals;

body 2.5 × 3 × 0.85 mm

12 3 4 5 6 7...14

中文翻译

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