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74AHC30BQ PDF预览

74AHC30BQ

更新时间: 2024-11-17 11:13:59
品牌 Logo 应用领域
安世 - NEXPERIA 逻辑集成电路
页数 文件大小 规格书
16页 250K
描述
8-input NAND gateProduction

74AHC30BQ 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:DHVQFN-14Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.61
系列:AHC/VHC/H/U/VJESD-30 代码:R-PQCC-N14
JESD-609代码:e4长度:3 mm
逻辑集成电路类型:NAND GATE湿度敏感等级:1
功能数量:1输入次数:8
端子数量:14最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装形状:RECTANGULAR
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
传播延迟(tpd):15.5 ns认证状态:Not Qualified
座面最大高度:1 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:30
宽度:2.5 mmBase Number Matches:1

74AHC30BQ 数据手册

 浏览型号74AHC30BQ的Datasheet PDF文件第2页浏览型号74AHC30BQ的Datasheet PDF文件第3页浏览型号74AHC30BQ的Datasheet PDF文件第4页浏览型号74AHC30BQ的Datasheet PDF文件第5页浏览型号74AHC30BQ的Datasheet PDF文件第6页浏览型号74AHC30BQ的Datasheet PDF文件第7页 
74AHC30; 74AHCT30  
8-input NAND gate  
Rev. 5 — 6 May 2020  
Product data sheet  
1. General description  
The 74AHC30; 74AHCT30 is a high-speed Si-gate CMOS device and is pin compatible with Low-  
power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7-A.  
The 74AHC30; 74AHCT30 provides an 8-input NAND function.  
2. Features and benefits  
Balanced propagation delays  
All inputs have Schmitt-trigger actions  
Inputs accept voltages higher than VCC  
Input levels:  
For 74AHC30: CMOS level  
For 74AHCT30: TTL level  
ESD protection:  
HBM JESD22-A114E exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
CDM JESD22-C101C exceeds 1000 V  
Multiple package options  
Specified from -40 °C to +85 °C and -40 °C to +125 °C  
3. Ordering information  
Table 1. Ordering information  
Type number  
Package  
Temperature  
range  
Name  
Description  
Version  
74AHC30D  
-40 °C to +125 °C  
-40 °C to +125 °C  
-40 °C to +125 °C  
SO14  
plastic small outline package; 14 leads;  
body width 3.9 mm  
SOT108-1  
74AHCT30D  
74AHC30PW  
74AHCT30PW  
74AHC30BQ  
74AHCT30BQ  
TSSOP14  
plastic thin shrink small outline package; 14 leads; SOT402-1  
body width 4.4 mm  
DHVQFN14 plastic dual in-line compatible thermal  
enhanced very thin quad flat package; no leads;  
14 terminals; body 2.5 × 3 × 0.85 mm  
SOT762-1  
74AHC30GU12  
-40 °C to +125 °C  
XQFN12  
plastic, extremely thin quad flat package; no leads; SOT1174-1  
12 terminals; body 1.70 × 2.0 × 0.50 mm  
 
 
 

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