74650-1001

更新时间： 2024-11-11 06:31:47

品牌	Logo	应用领域
莫仕 - MOLEX		连接器集管和边缘连接器 PC
页数	文件大小	规格书
2页	609K
描述
2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane Connector System

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74650-1001 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8536.69.40.40
风险等级：	5.84	其他特性：	10 SHIELD CONTACTS IN 2 ROWS, POLARIZED
主体宽度：	0.85 inch	主体深度：	0.484 inch
主体/外壳类型：	RECEPTACLE	连接器类型：	BOARD CONNECTOR
联系完成配合：	GOLD (30) OVER NICKEL	触点性别：	MALE
触点材料：	NOT SPECIFIED	触点模式：	RECTANGULAR
触点电阻：	10 m Ω	触点样式：	SQ PIN-SKT
DIN 符合性：	NO	介电耐压：	750VAC V
耐用性：	200 Cycles	滤波功能：	NO
IEC 符合性：	NO	最大插入力：	.3892 N
绝缘电阻：	10000000000 Ω	绝缘体颜色：	BLACK
绝缘体材料：	GLASS FILLED LIQUID CRYSTAL POLYMER	MIL 符合性：	NO
插接触点节距：	0.079 inch	匹配触点行间距：	0.089 inch
混合触点：	NO	安装选项1：	GUIDE PIN
安装方式：	STRAIGHT	安装类型：	BOARD
连接器数：	ONE	PCB行数：	8
装载的行数：	8	最高工作温度：	105 °C
最低工作温度：	-55 °C	选件：	GENERAL PURPOSE
PCB接触模式：	RECTANGULAR	PCB触点行间距：	2.2606 mm
极化密钥：	POLARIZED HOUSING	额定电流（信号）：	1 A
参考标准：	UL	可靠性：	COMMERCIAL
子类别：	Headers and Edge Type Connectors	端子长度：	0.098 inch
端子节距：	2 mm	端接类型：	PRESS FIT
触点总数：	60	UL 易燃性代码：	94V-0
Base Number Matches：	1

74650-1001 数据手册

2.00 by 2.25mm

FEATURES AND SPECIFICATIONS

(.079 by .089") Pitch

5-Row, 6-Row and 8-Row

VHDM-HSD

Module-to-Backplane

Connector System

Features and Beneﬁts

Up to 5.0 Gbps bandwidth per signal pair enables

state-of-the-art system design and performance

™

2.00 by 2.25mm (.079 by .089”) pitch provides real

signal density of 10 differential pairs for 5-row and

6-row and 15 differential pairs for 8-row per

centimeter (25 and 38 pairs respectively per inch)

Minimum distance between daughtercards:

– 5-row system offers 15.00mm (.591")

– 6-row system offers 18.00mm (.709")

– 8-row system offers 22.00mm (.866")

Ground planes between signal columns provide

tightly controlled impedance for rise times down to

50 picoseconds (10-90%). This ensures very low

cross talk between signals within and between

columns

Ground pins are in the same grid as signal pins,

allowing wider channels for PCB routing and traces

up to 0.25mm (.010”) wide

6-row or 8-row VHDM-HSD wafers can be applied to

the same stiffener as standard VHDM 6-row or 8-

row wafers. The combination of VHDM and VHDM-

HSD wafers, grouped together in the same stiffener,

provides cost effective solutions to different

performance parameters

The Very High Density Metric High Speed Differential

The daughtercard connector consists of a metal stiffener The backplane connectors feature headers with open

(VHDM-HSD) connector system has been expanded to just as with the VHDM system. The system combines the ends for continuous side-to-side stacking and headers

include 5-row, 6-row and 8-row daughtercard and

backplane modules. VHDM-HSD is designed for

signal wafers, power modules and guidance modules

into one continuous connector that can be ordered as a in proper alignment of the mating daughtercard. The

with guide pins and polarizing keys on either end to aid

differential-pair architecture applications that require single speciﬁc part number. The card pitch of the VHDM- power modules occupy just a small width and hold

very high interconnect density and signal integrity in a HSD 8-row system is the same as the standard VHDM 8- sequentially matable pins that each manage 10.0 amps

single-ended conﬁguration.

row system, allowing both signal wafer types for single of current.

ended and differential pair to be used together. This

The same great modularity features and components of

VHDM are provided in the VHDM-HSD. The 5-row and 6-

row systems feature 2 signal pairs per column and the

8-row system features 3 signal pairs per column in

increments of 10 and 25 columns. All circuits are

utilized as signal circuits without the need to use some as

ground circuits.

Molex offers application tooling for pressing VHDM-HSD

modularity and design ﬂexibility allow engineers to

incorporate both connector systems on the same

platforms. The system is based on a 2.00mm (.079")

pitch and includes vertical and right angle products that

can be conﬁgured up to 2000 circuits. The maximum

length of a daughtercard connector on a single stiffener

is 300mm (12").

connectors into PCBs as separate modules or as complete

assemblies. VHDM-HSD cable assemblies are also

available for connecting backplane headers to high-

performance cables.

Note: VHDM and VHDM-HSD are trademarks or registered trademarks of Teradyne,Inc.

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与74650-1001相关器件

型号	品牌	获取价格	描述	数据表
74650-1002	MOLEX	获取价格	2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane C
74650-1003	MOLEX	获取价格	2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplan
74650-1004	MOLEX	获取价格	2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane C
74650-1011	MOLEX	获取价格	2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplan
74650-1012	MOLEX	获取价格	2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplan
74650-1013	MOLEX	获取价格	2.00 by 2.25mm (.079 by .089") Pitch 5-Row, 6-Row and 8-Row VHDM-HSD Module-to-Backplane C
74650-1014	MOLEX	获取价格	2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplan
74650-1024	MOLEX	获取价格	Board Connector, 60 Contact(s), 8 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Term
74650-1048	MOLEX	获取价格	Board Connector, 60 Contact(s), 8 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Term
74650-1051	MOLEX	获取价格	2.00mm (.079") Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Pin End Ver

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